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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
|
325
|
Price on request
325
|
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
324
|
Price on request
324
|
Tin-Lead | - | Phosphor Bronze | Closed Frame | Thermoplastic | Surface Mount | 84 (4 x 21) | - | 0.050" (1.27mm) | Solder | PLCC | |
Keystone Electronics
|
300
|
Price on request
300
|
Tin | - | Brass | Closed Frame | Polyester, Glass Filled | Chassis Mount | 3 (Rectangular) | - | - | Solder | Transistor, TO-3 | |
Keystone Electronics
|
300
|
Price on request
300
|
- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
|
288
|
Price on request
288
|
Gold | 25.0µin (0.63µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
271
|
Price on request
271
|
Tin | 100.0µin (2.54µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
252
|
Price on request
252
|
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
|
245
|
Price on request
245
|
Tin | - | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS) | Surface Mount | 44 (4 x 11) | - | 0.100" (2.54mm) | Solder | PLCC | |
TE Connectivity
|
236
|
Price on request
236
|
Tin | - | Beryllium Copper | Closed Frame | Thermoplastic | Through Hole | 8 (2 x 4) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
|
223
|
Price on request
223
|
Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Thermoplastic | Surface Mount | 44 (4 x 11) | - | 0.050" (1.27mm) | Solder | PLCC | |
TE Connectivity
|
221
|
Price on request
221
|
Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Thermoplastic | Surface Mount | 44 (4 x 11) | - | 0.050" (1.27mm) | Solder | PLCC | |
Samtec Inc.
|
218
|
Price on request
218
|
Tin | - | Beryllium Copper | Closed Frame | Liquid Crystal Polymer (LCP) | Surface Mount | 44 (4 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PLCC | |
TE Connectivity
|
218
|
Price on request
218
|
Tin-Lead | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
200
|
Price on request
200
|
Gold | 15.0µin (0.38µm) | Copper Alloy | Open Frame | Thermoplastic | Surface Mount | 2011 (47 x 58) | - | 0.035" (0.90mm) | Solder | LGA | |
Preci-Dip
|
200
|
Price on request
200
|
Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
198
|
Price on request
198
|
Tin-Lead | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
|
198
|
Price on request
198
|
Tin | - | Beryllium Copper | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 25 (1 x 25) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
3M Electronic Solutions
|
190
|
Price on request
190
|
Tin | 160.0µin (4.06µm) | Copper Alloy | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Surface Mount | 28 (4 x 7) | -40°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
Preci-Dip
|
188
|
Price on request
188
|
Tin | - | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 44 (4 x 11) | - | 0.100" (2.54mm) | Solder | PLCC | |
Mill-Max Manufacturing
|
186
|
Price on request
186
|
Gold | 10.0µin (0.25µm) | Brass Alloy | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 179 (18 x 18) | - | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
185
|
Price on request
185
|
Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
182
|
Price on request
182
|
- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
|
172
|
Price on request
172
|
Tin | - | Phosphor Bronze | Open Frame | - | Through Hole, Right Angle, Vertical | 28 (2 x 14) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
|
171
|
Price on request
171
|
Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
|
169
|
Price on request
169
|
Tin | - | Beryllium Copper | Open Frame | Liquid Crystal Polymer (LCP) | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
168
|
Price on request
168
|
Gold | 30.0µin (0.76µm) | Copper Alloy | Open Frame | Thermoplastic | Surface Mount | 3647 | - | - | Solder | LGA | |
Mill-Max Manufacturing
|
168
|
Price on request
168
|
Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (2 x 34) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
3M Electronic Solutions
|
166
|
Price on request
166
|
Tin | 160.0µin (4.06µm) | Copper Alloy | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Surface Mount | 32 (2 x 7, 2 x 9) | -40°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
3M Electronic Solutions
|
162
|
Price on request
162
|
Tin | 160.0µin (4.06µm) | Copper Alloy | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 28 (4 x 7) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
Mill-Max Manufacturing
|
151
|
Price on request
151
|
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
|
150
|
Price on request
150
|
Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
150
|
Price on request
150
|
Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Adam Technologies Inc
|
144
|
Price on request
144
|
Tin | 80.0µin (2.03µm) | Phosphor Bronze | Closed Frame | Thermoplastic | Surface Mount | 44 (4 x 11) | -55°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
TE Connectivity
|
138
|
Price on request
138
|
Tin | - | Beryllium Copper | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 16 (1 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Assmann WSW Components
|
135
|
Price on request
135
|
Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT) | Through Hole | 14 (2 x 7) | -55°C ~ 85°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
|
127
|
Price on request
127
|
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Harwin Inc.
|
125
|
Price on request
125
|
Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | Through Hole | 32 (1 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Mill-Max Manufacturing
|
125
|
Price on request
125
|
Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
|
122
|
Price on request
122
|
Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
120
|
Price on request
120
|
Tin | - | Phosphor Bronze | Open Frame | - | Through Hole | 24 (2 x 12) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
|
118
|
Price on request
118
|
Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
|
117
|
Price on request
117
|
Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Liquid Crystal Polymer (LCP) | Through Hole | 160 (4 x 40) | - | 0.050" (1.27mm) | Solder | QFP | |
TE Connectivity
|
116
|
Price on request
116
|
Gold | 29.5µin (0.75µm) | Beryllium Copper | Closed Frame | Thermoplastic, Polyester | Through Hole | 10 (1 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
|
113
|
Price on request
113
|
Tin-Lead | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Harwin Inc.
|
112
|
Price on request
112
|
Tin | Flash | Beryllium Copper | Open Frame | Plastic | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
|
108
|
Price on request
108
|
Gold | 20.0µin (0.51µm) | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 20 (2 x 10) | - | 0.100" (2.54mm) | Solder | - | |
Omron
|
100
|
Price on request
100
|
Gold | 29.5µin (0.75µm) | Beryllium Copper | Carrier | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Keystone Electronics
|
98
|
Price on request
98
|
Tin | - | Brass | Closed Frame | Polyester, Glass Filled | Chassis Mount | 10 (Round) | - | - | Solder | Transistor, TO-100 | |
3M Electronic Solutions
|
95
|
Price on request
95
|
Gold | 250.0µin (6.35µm) | Beryllium Copper | Closed Frame | Polyether Imide (PEI), Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
3M Electronic Solutions
|
83
|
Price on request
83
|
Tin | 35.4µin (0.90µm) | Phosphor Bronze | Open Frame | Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -25°C ~ 85°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing |