828-AG11D TE Connectivity 828-AG11D is a 28 position DIP socket with 2.54mm pitch and 0.6" row spacing, through hole mounting with solder termination.
Mfr Part #:

828-AG11D

Available from 3 distributors
Mfr Name: TE Connectivity
TE Connectivity
TE Connectivity 828-AG11D is a 28 position DIP socket with 2.54mm pitch and 0.6" row spacing, through hole mounting with solder termination.
Total Stock: 218 pcs

828-AG11D Available from 3 distributors

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
194 pcs
194 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
15 pcs
15 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
9 pcs
9 pcs On Request 1 On Request On Request On Request On Request On Request

828-AG11D Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Contact Finish
Contact Finish Thickness
Contact Material
Features
Housing Material
Lead Spacing
Mounting Type
Number of Positions
Number of Positions or Pins (Grid)
Operating Temperature
Operating Temperature Range
Pitch
Row Spacing
Termination
Termination Style
Type

828-AG11D Description

Short technical summary and product information.

The TE Connectivity 828-AG11D is a 28 position DIP socket designed for through hole mounting. It features a 2.54mm pitch and 0.6" (15.24mm) row spacing, making it suitable for standard DIP packages. The socket uses tin-lead plated copper alloy contacts with a thickness of 25.0µin (0.63µm) and a polyester housing. It has an open frame design and operates over a temperature range of -55°C to 105°C. This socket is ideal for prototyping and production applications requiring reliable IC connections.

828-AG11D Quick Information

Product Type: IC Socket
Canonical Name: TE Connectivity 828-AG11D 28 Position DIP Socket
Subcategory: IC Sockets

828-AG11D Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

828-AG11D Features

  • 28 position DIP socket with 2.54mm pitch.
  • 0.6" (15.24mm) row spacing for DIP packages.
  • Through hole mounting with solder termination.
  • Tin-lead plated copper alloy contacts.
  • Open frame polyester housing design.

828-AG11D Applications

  • Used for prototyping DIP IC connections.
  • Ideal for production socketing of DIP packages.
  • Suitable for high temperature environments.

828-AG11D FAQs

5 frequently asked questions generated from this part’s specifications.
How many positions does the 828-AG11D have?

The 828-AG11D has 28 positions arranged in a 2x14 grid.

What is the pitch of this DIP socket?

The pitch is 2.54mm (0.100").

What is the row spacing?

The row spacing is 15.24mm (0.6").

What is the mounting type?

Through hole mounting with solder termination.

What is the operating temperature range?

-55°C to 105°C.

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