| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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350 pcs
|
350 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The TE Connectivity 828-AG11D-ES is a 28-position DIP IC socket designed for through hole mounting. It features a 2.54mm (0.100") pitch and a 0.6" (15.24mm) row spacing, making it suitable for standard DIP packages. The socket uses a copper alloy contact material with a tin-lead finish of 25.0µin (0.63µm) and a polyester housing.
This open frame socket operates over a temperature range of -55°C to 105°C. It is intended for use in applications requiring reliable solder termination for DIP ICs. The socket's construction allows for easy insertion and removal of ICs while maintaining secure electrical contact.
28 positions (2 x 14).
2.54mm (0.100").
Through hole.
-55°C to 105°C.
Tin-lead with 25.0µin (0.63µm) thickness.