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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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127 pcs
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127 pcs | On Request | 1 | On Request | On Request | 0838 | On Request | On Request |
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This 14-position DIP IC socket from TE Connectivity is designed for reliable interconnection of dual in-line package (DIP) integrated circuits. It features a closed-frame thermoplastic housing with a 0.3" (7.62mm) row spacing and 2.54mm (0.100") pitch. The socket accepts standard 14-pin DIP devices.
The contacts are made of beryllium copper with a gold finish of 30.0µin (0.76µm) thickness, ensuring excellent conductivity and corrosion resistance. The through-hole mounting style with solder termination makes it suitable for traditional PCB assembly processes. The operating temperature range is -55°C to 125°C, allowing use in a wide variety of environments.
This socket is part of TE Connectivity's portfolio of IC sockets designed for prototyping and production applications. The closed frame design provides mechanical protection for the contacts. The part is compliant with RoHS3 and REACH directives (unverified). No pricing or lead time information is available from the source data.
14 positions (2 x 7).
2.54mm (0.100").
Through hole with solder termination.
Gold, 30.0µin (0.76µm) thickness.
-55°C to 125°C.
0.3" (7.62mm).