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2201838-1 LGA socket with 2011 positions arranged in a 47x58 grid, 0.90mm pitch, gold plated contacts, and open frame thermoplastic housing for surface mount soldering.
Mfr Part #:

2201838-1

Available from 1 distributors
Mfr Name: TE Connectivity
TE Connectivity
LGA socket with 2011 positions arranged in a 47x58 grid, 0.90mm pitch, gold plated contacts, and open frame thermoplastic housing for surface mount soldering.
✓ Total Stock: 200 pcs

2201838-1 Available from 1 distributor

✓ Authorised
✓ Non-Authorised
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200 pcs
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200 pcs On Request 1 On Request On Request On Request On Request On Request
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2201838-1 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Contact Finish
Contact Finish Thickness
Contact Material
Features
Housing Material
Lead Spacing
Lead Style
Mounting Type
Number of Positions or Pins (Grid)
Package / Case
Pitch
Termination
Type
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2201838-1 Description

Short technical summary and product information.

The TE Connectivity 2201838-1 is a Land Grid Array (LGA) socket designed for high-density interconnection of IC packages. It features 2011 positions arranged in a 47x58 grid with a 0.90mm pitch.

 

The socket uses gold-plated copper alloy contacts with a 0.38µm finish thickness for reliable electrical performance. The open frame thermoplastic housing allows for improved airflow and inspection of solder joints. This socket is terminated via solder to surface mount pads.

 

This component is suitable for use in applications requiring a large number of interconnections within a compact footprint. The open frame design supports thermal management in systems with high power dissipation.

2201838-1 Quick Information

Product Type: LGA Socket
Canonical Name: TE Connectivity 2201838-1 LGA Socket, 2011 Positions, 0.90mm Pitch, Gold Contact, Solder Termination
Subcategory: LGA Socket

2201838-1 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: Non-Compliant

2201838-1 Features

  • LGA socket with 2011 positions in 47x58 grid.
  • 0.90mm pitch for dense interconnections.
  • Gold plated contacts for reliable signal transmission.
  • Open frame thermoplastic housing for airflow.
  • Surface mount solder termination.

2201838-1 Applications

  • For LGA packaged processors and ASICs.
  • High pin count IC socket applications.
  • Surface mount designs requiring fine pitch.

2201838-1 FAQs

5 frequently asked questions generated from this part’s specifications.
How many positions does this LGA socket have?

The TE Connectivity 2201838-1 socket has 2011 positions arranged in a 47x58 grid.

What is the pitch of this socket?

The pitch is 0.90mm.

What mounting type does this socket use?

The socket is surface mount with solder termination.

What is the contact material and finish?

The contacts are copper alloy with a gold finish of 0.38µm thickness.

Is this socket RoHS compliant?

RoHS3 compliance is indicated but unverified.

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