Aries Electronics

<p>The Aries Electronics 14-810-90 is a 14-position DIP socket designed for vertical through-hole mounting. It features a closed-frame design with bifurcated phosphor bronze contacts plated with 10µin gold over nickel. The socket accepts standard DIP packages with 0.3" (7.62mm) row spacing and 2.54mm pitch.</p><p>&nbsp;</p><p>Electrical ratings include a current rating of 1.5A per contact and an operating temperature range up to 125°C with gold plating. The insertion force averages 110g per pin, and withdrawal force averages 75g per pin. The housing is made of black UL 94V-0 rated 4/6 nylon.</p><p>&nbsp;</p><p>This socket is suitable for packaging LEDs, incandescent lamps, DIP switches, test points, and displays. It accepts flat leads up to 0.014" thick and round leads up to 0.020" diameter. The suggested PCB hole size is 0.044" ±0.002".</p>

<p>The C8124-04 is a 24-pin DIP IC socket from Aries Electronics' C81/C91 series, featuring dual beam edge-grip contacts for high retention and positive wiping action. It has a 0.6" (15.24mm) row spacing and 2.54mm pitch, with wire wrap termination for reliable connections in prototyping and production applications.</p><p>&nbsp;</p><p>The socket is rated for 1.5A per contact with an initial contact resistance of 20 mΩ. Insulation resistance is 100 MΩ at 500 VDC, and dielectric withstanding voltage is 1000 VAC. The housing is made of black UL 94V-0 glass-filled 4/6 Nylon, and contacts are phosphor bronze with a 200µin (5.08µm) matte tin plating. The closed frame design includes a removable cover for lower profile applications.</p><p>&nbsp;</p><p>Mounting is through hole, with a suggested PCB hole size of 0.046" ±0.002 (1.17mm ±0.05mm). The body dimensions are 1.280" x 1.100" x 0.600" (without cover). Operating temperature range is -55°C to 105°C. The socket is solderable per MIL-STD-202, Method 208.</p>

<p>The 96-160M65 is a socket adapter from Aries Electronics designed to convert a 160-pin, 0.65mm pitch QFP surface-mount package to a 15x15 PGA footprint. This allows the use of less expensive QFP packages in designs originally intended for PGA sockets.</p><p>&nbsp;</p><p>Key specifications include a 2.54mm (0.100") pitch on the PGA side, through-hole mounting with solder termination, and an operating temperature range up to 105°C. The adapter body is made of FR-4 epoxy glass with 1-oz copper traces and ENIG pad finish. Pins are brass with Sn/Pb plating.</p><p>&nbsp;</p><p>The adapter is suited for prototyping or production where a QFP IC needs to be interfaced with a PGA socket. The pins are mechanically fastened and soldered using Aries' patented process for reliable connection. Suggested PCB hole size is 0.028 ±0.003" diameter.</p><p>&nbsp;</p><p>The adapter is RoHS3 compliant (unverified) and has MSL 1 unlimited. It is a through-hole component with a tin contact finish. The part number 96-160M65 is the standard version; panelized and wire-wrap versions are also available.</p>

<p>The 08-2513-10 is an 8-position DIP socket manufactured by Aries Electronics. It features a 2.54mm pitch and 5.08mm row spacing, designed for through hole mounting with solder termination. The socket uses a closed frame housing made of black UL 94V-0 glass-filled 4/6 Nylon, providing robust mechanical support and flame retardancy.</p><p>&nbsp;</p><p>The contacts are beryllium copper collet type with a tin finish (0.25µm thickness), rated for 3 amps continuous current. The socket accepts leads with diameters from 0.38mm to 0.64mm and lengths from 2.54mm to 3.71mm. The suggested PCB hole diameter is 0.76mm. Insertion force is 180g per pin, withdrawal force is 90g per pin, and normal force is 140g per pin, based on a 0.46mm test lead.</p><p>&nbsp;</p><p>Operating temperature range is -55°C to 105°C. The socket is suitable for DIP package integrated circuits in prototyping, production, and industrial applications. The closed frame design provides protection and stability during handling and soldering.</p>

<p>The Aries Electronics 14-823-90C is a 14-position DIP IC socket designed for through hole, right angle, horizontal mounting. It features a 2.54mm (0.100") pitch and 0.3" (7.62mm) row spacing, making it suitable for standard 14-pin DIP packages. The socket uses a closed frame housing made of glass-filled polyamide (PA46) nylon 4/6, providing robust mechanical support. Contacts are made of beryllium copper with a 30.0µin (0.76µm) tin finish, ensuring reliable electrical connections and good solderability. The operating temperature range is -55°C to 105°C, allowing use in a wide variety of environments. Termination is via solder connections. This socket is ideal for prototyping, production, and applications requiring a secure, low-profile connection for DIP ICs.</p>

<p>The 24-516-11 is a 24-position DIP Zero Insertion Force (ZIF) socket from Aries Electronics, part of the Series 516 family. It allows insertion and removal of ICs without bending leads, using a dual lever arm cam action that closes contacts after insertion.</p><p>&nbsp;</p><p>Key specifications include a pitch of 2.54mm (0.100"), through hole mounting with solder termination, and a closed frame design. The housing is black UL 94V-0 glass-filled 4/6 nylon. Contacts are beryllium copper with 10µin gold plating over nickel. Current rating is 1 Amp, operating temperature up to 125°C.</p><p>&nbsp;</p><p>The socket accepts lead lengths from 1.91 to 6.35mm and provides a minimum retention force of 15 grams per lead when closed. Suggested PCB hole size is 0.89 ±0.05mm diameter. The tapered entry guides device legs into position.</p><p>&nbsp;</p><p>This socket is suitable for applications requiring frequent device changes or where delicate IC leads must be protected. The wiping action during cam closure ensures a gas-tight connection.</p>

<p>The Aries Electronics 32-653000-10 is a PLCC-to-DIP socket adapter designed to convert PLCC packaged ICs to DIP footprints for prototyping and testing. It features 32 pins with a 2.54mm pitch and 0.6" (15.24mm) row spacing on the DIP side. The adapter body is made of FR4 epoxy glass, 1.58mm thick, with 1-oz copper traces. Pins are brass 360 1/2-hard per UNS C36000 with tin-lead plating. The adapter is through hole mount with solder termination. It is rated for 1 amp current and operates up to 105°C. Suggested PCB hole size is 0.71 ±0.08 mm. The adapter accepts an optional PLCC surface mount socket with UL 94V-0 PPS housing and phosphor bronze, tin-plated contacts.</p>

<p>The Aries Electronics 1107741 is a 14-pin full size oscillator socket designed for use with standard 14-pin DIP oscillator packages. The socket features a 4-fingered collet contact made of beryllium copper alloy (UNS C17200) with a minimum 10μ gold over 50μ nickel plating, ensuring reliable electrical connections. It is rated for 3A per pin and operates at temperatures up to 105°C (221°F).</p><p>&nbsp;</p><p>The body is constructed from black UL94V-0 glass-filled 4/6 Nylon, providing excellent flame retardancy. The pin body is brass alloy 360 with a minimum 200μ tin over 100μ nickel plating. The socket is through-hole mountable, machine insertable, and designed to be stackable end-to-end and side-to-side for space-efficient layouts.</p><p>&nbsp;</p><p>Mechanical specifications include an insertion force of 180g/pin, withdrawal force of 90g/pin, and normal force of 140g/pin, based on a 0.018 inch test lead. The socket accepts lead diameters of 0.015-0.025 inch (0.38-0.64 mm) and lead lengths of 0.100-0.146 inch (2.54-3.71 mm). The suggested PCB hole diameter is 0.030 ± 0.002 inch (0.76 ± 0.05 mm).</p>