| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
21 pcs
|
21 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Board Material | |
| Contact Finish | |
| Convert From (Adapter End) | |
| Convert To (Adapter End) | |
| Mounting Type | |
| Number of Pins | |
| Pitch | |
| Tape & Reel | |
| Termination |
The 20-555000-00 is a socket adapter designed by Aries Electronics to convert a 20-pin SSOP (Shrink Small Outline Package) to a SOWIC (Small Outline Wide Integrated Circuit) footprint. This adapter enables prototyping or testing of SSOP devices on SOWIC-compatible boards without permanent soldering of the IC.
The adapter has 20 pins with a pitch of 1.27mm (0.050"). It uses surface mount solder termination and features a tin-lead contact finish. The board is constructed from FR4 epoxy glass, providing good mechanical stability and insulation for repeated use.
This component is categorized under Socket Adapters within Connectors, Interconnects. It is suitable for applications requiring temporary or permanent conversion between SSOP and SOWIC package styles.
| Qty | Low | High |
|---|---|---|
| 360+ | $17.24 | $17.24 |
| 500+ | $17.16 | $17.16 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The adapter has 20 pins.
The pitch is 1.27mm (0.050").
It converts from SSOP to SOWIC.
Surface mount with solder termination.
FR4 epoxy glass.