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14 pcs
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14 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Aries Electronics 08-350000-10 is a socket adapter designed to convert SOIC packages to DIP (Dual In-line Package) format. It supports 8 positions with a 0.3-inch (7.62mm) row spacing, making it suitable for various prototyping and board modification applications.
The adapter is constructed with a 0.062-inch thick FR-4 epoxy glass board material. It features through-hole mounting for secure integration onto PCBs. The pins are made of Brass 360 1/2-hard and are plated with Tin or Tin-Lead for reliable conductivity.
Key specifications include a pitch of 1.27mm (0.050") for mating and 2.54mm (0.100") for the post termination. The operating temperature range is up to 105°C. This adapter facilitates upgrading to SOJ or SOIC packages without altering existing PCB layouts.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The adapter accepts SOIC packages.
The row spacing is 0.3 inches (7.62mm).
The operating temperature is up to 105°C.
The RoHS status is RoHS3 Compliant.
The MSL is 1.