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20 pcs
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20 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Aries Electronics 16-350000-10 is an adapter designed to convert SOIC packages to a DIP (Dual In-line Package) format. This allows for easier prototyping and integration of surface-mount devices onto breadboards or through-hole PCBs without altering the board layout.
This specific adapter is designed for 16-position SOIC packages and features a center spacing of 0.300 inches (7.62mm). The board material is FR-4, known for its durability and electrical insulation properties, with a thickness of 0.062 inches (1.57mm). The pins are constructed from Brass 360 1/2-hard and are plated with Tin or Tin/Lead over Nickel for reliable conductivity.
The adapter operates within a temperature range of up to 221°F (105°C). It is suitable for SMD to DIP prototyping applications. The suggested PCB hole size for mounting is 0.028 ±0.003 inches (0.71 ±0.08mm) in diameter.
This product is RoHS3 compliant, MSL 1, and REACH unaffected, making it suitable for a wide range of electronic manufacturing and development projects.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The adapter accepts SOIC packages.
The adapter has 16 positions.
The center spacing is 7.62mm (0.300").
The operating temperature is up to 105°C.
The board material is FR-4.
Yes, the adapter is RoHS3 Compliant.