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20-350000-11-RC-P This Aries Electronics adapter converts SOIC packages to DIP format, featuring 20 positions and a 0.300 inch center spacing. It is constructed with FR4 board material.
Mfr Part #:

20-350000-11-RC-P

Available from 1 distributors
Mfr Name: Aries Electronics
Aries Electronics
This Aries Electronics adapter converts SOIC packages to DIP format, featuring 20 positions and a 0.300 inch center spacing. It is constructed with FR4 board material.
✓ Total Stock: 176 pcs
$ Price Range: $0.99

20-350000-11-RC-P Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Braun Electronic Components ✓
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176 pcs
On Request
176 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

20-350000-11-RC-P Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Board Thickness
Lead Spacing
Length
Material
Mounting Type
Number of Positions
Operating Temperature
Package Accepted
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Proto Board Type
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20-350000-11-RC-P Description

Short technical summary and product information.

The Aries Electronics 20-350000-11-RC-P is a cost-effective adapter designed to upgrade SOIC components to a DIP footprint without altering PCB layouts. It supports SOIC packages and provides 20 positions with a standard 0.300 inch (7.62mm) center spacing.

 

The adapter is built on a 0.062 inch (1.57mm) thick FR4 board material. The pads are finished with ENIG (Immersion Gold over Electroless Nickel), and the pins are made of Brass 360 1/2-hard with a plating of 10µ min. Gold over 100µ min. Nickel. The operating temperature range is specified up to a maximum of 105°C.

 

This adapter is suitable for through-hole mounting and is designed for applications requiring the conversion of surface-mount SOIC components to a through-hole DIP configuration. It offers a practical solution for prototyping and board modifications.

20-350000-11-RC-P Quick Information

Product Type: Adapter, Breakout Board
Series: 350000-11-RC
Canonical Name: Aries Electronics SOIC to DIP Adapter, 20 Position
Subcategory: SOIC to DIP

20-350000-11-RC-P Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

20-350000-11-RC-P Estimated Pricing

Qty Low High
1+ $0.99 $0.99

Estimated market price range - modelled values for guidance only, not live distributor offers.

20-350000-11-RC-P Features

  • Adapts SOIC to DIP without PCB changes.
  • Features 20 positions on 0.300" centers.
  • Constructed with FR4 epoxy glass material.
  • Operates up to 105°C maximum temperature.
  • ENIG pad finish with gold-plated brass pins.

20-350000-11-RC-P Applications

  • Facilitates SOIC component integration.
  • Useful for prototyping and board modifications.
  • Enables conversion to DIP footprint.
  • Supports through-hole mounting applications.

20-350000-11-RC-P FAQs

5 frequently asked questions generated from this part’s specifications.
What type of adapter is the 20-350000-11-RC-P?

The 20-350000-11-RC-P is an SOIC to DIP adapter.

How many positions does the 20-350000-11-RC-P adapter have?

This adapter has 20 positions.

What is the center spacing for this adapter?

The adapter has 0.300 inch [7.62mm] centers.

What is the maximum operating temperature for this adapter?

The maximum operating temperature is 105°C.

What material is the board of the 20-350000-11-RC-P made from?

The board is made from FR4 Epoxy Glass.

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