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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

4,360 active parts
37 manufacturers
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
ZL50235/GDC
ZL50235/GDC
Microchip Technology
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 - - - - - 40mA - - - - - - - Echo Cancellation - - - LIU - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 1.6V ~ 2V - -
ZL50117GAG
ZL50117GAG
Microsemi Corporation
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL38065QCG1
ZL38065QCG1
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 100-LQFP - - - - - - - - 1.6V ~ 2V - -
ZL50022GAC
ZL50022GAC
Microchip Technology
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 - - - - - 175mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50060GAG2
ZL50060GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50112GAG
ZL50112GAG
Microsemi Corporation
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 552-PBGA (35x35) - - - - - - - - 1.65V ~ 1.95V - -
BU8766FV-E2
BU8766FV-E2
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ROHM Semiconductor
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 - - - - - - - - - - - - - Tone Generator - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 450 mW - - - - - - - - 16-SSOP-B - - - - - - - - 2.2V ~ 3.6V - -
ZL50021QCG1
ZL50021QCG1
Microchip Technology
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 - - - - - 1.75mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-LQFP (28x28) - - - - - - - - 1.71V ~ 1.89V - -
MC33215BE
MC33215BE
Freescale Semiconductor
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 - - - - - - - - - - - - - Voice-Switched Speakerphone - - - - - - - Through Hole - 1 - - -20°C ~ 70°C - - - - - - - - - - - - - - - 42-PDIP - - - - - - - - - - -
ZL50031QEG1
ZL50031QEG1
Microchip Technology
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 - - - - - 480mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-MQFP (28x28) - - - - - - - - 3V ~ 3.6V - -
ZL50073GAG2
ZL50073GAG2
Microchip Technology
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 - - - - - 500mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 484-PBGA (23x23) - - - - - - - - 1.71V ~ 1.89V - -
ZL49031DCE1
ZL49031DCE1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 18-SOIC - - - - - - - - 4.75V ~ 5.25V - -
ZL50057GAG2
ZL50057GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 272-PBGA (27x27) - - - - - - - - 1.71V ~ 1.89V - -
ZL50120GAG2
ZL50120GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
VSC8552XKS-02
VSC8552XKS-02
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Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 256-PBGA (17x17) - - - - - - - - 1V - -
LE88830KQCT
LE88830KQCT
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 24-QFN (6x6) - - - - - - - - - - -
LE89010QVCT
LE89010QVCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
LE89116QVC
LE89116QVC
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
LE89116QVCT
LE89116QVCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
LE89136QVC
LE89136QVC
Microchip Technology
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 - - - - - - - - - - - - - SLAC - - - - - - - - - 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
LE89136QVCT
LE89136QVCT
Microchip Technology
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 - - - - - - - - - - - - - SLAC - - - - - - - - - 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
LE89316QVC
LE89316QVC
Microchip Technology
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 - - - - - - - - - - - - - - - - - 4-Wire Serial - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
PEB 20525 F V1.3
PEB 20525 F V1.3
Download Datasheet for PEB 20525 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3V ~ 3.6V - -
LE89336QVC
LE89336QVC
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
LE89336QVCT
LE89336QVCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 48-LQFP - - - - - - - - - - -
LE89810BSCT
LE89810BSCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 16-SOIC - - - - - - - - - - -
LE89830JSC
LE89830JSC
Microchip Technology
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 - - - - - - - - - - - - - - - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 16-SOIC - - - - - - - - - - -
PEB 20256 E V2.2
PEB 20256 E V2.2
Download Datasheet for PEB 20256 E V2.2
Infineon Technologies
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 - - - - - 200mA - - - - - - - Network Controller - - - HDLC, PPP, SS7, TMA - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - 3 W - - - - - - - - PG-BGA-388-2 - - - - - - - - 3V ~ 3.6V - -
LE89900AMCT
LE89900AMCT
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 10-MSOP - - - - - - - - - - -
LE89156PQCT
LE89156PQCT
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-QFN (7x7) - - - - - - - - 3.135V ~ 3.465V - -
SI32193-A-ZM2
SI32193-A-ZM2
Download Datasheet for SI32193-A-ZM2
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - 3-Wire - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 38-QFN (4x6) - - - - - - - - 3.3V - -
LE88136BLC
LE88136BLC
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 44-eLQFP - - - - - - - - - - -
LE9531DMQCT
LE9531DMQCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - - - 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.3V - -
LE9500ABJCT
LE9500ABJCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
LE9500BBJC
LE9500BBJC
Microsemi Corporation
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
LE9500BBJCT
LE9500BBJCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
LE9500CBJCT
LE9500CBJCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
BCM56442XB0IFSBG
BCM56442XB0IFSBG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
LE9500DBJC
LE9500DBJC
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
LE9500DBJCT
LE9500DBJCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 3.3V - -
LE9502BTC
LE9502BTC
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Microchip Technology
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 2-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-eTQFP (10x10) - - - - - - - - 3.3V - -
LE9520CDTCT
LE9520CDTCT
Microsemi Corporation
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 64-eTQFP - - - - - - - - 3.3V - -
LE9520DDTC
LE9520DDTC
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 64-eTQFP - - - - - - - - 3.3V - -
LE9520DDTCT
LE9520DDTCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 64-eTQFP - - - - - - - - 3.3V - -
LE9520SDDTC
LE9520SDDTC
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - - - 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.3V - -
LE9520SDDTCT
LE9520SDDTCT
Microchip Technology
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 - - - - - 40mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - Parallel - - - - - 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.3V - -
LE88111BLC
LE88111BLC
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 44-eLQFP - - - - - - - - 3V, 5V - -
LE88111BLCT
LE88111BLCT
Microsemi Corporation
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 44-eLQFP - - - - - - - - 3V, 5V - -
PEB 20256 E V2.1
PEB 20256 E V2.1
Download Datasheet for PEB 20256 E V2.1
Infineon Technologies
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 - - - - - 200mA - - - - - - - Multichannel Network Interface Controller (MUNICH) - - - HDLC, PPP, Serial, TMA - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - 3 W - - - - - - - - PG-BGA-388-2 - - - - - - - - 3V ~ 3.6V - -
PEB 3331 HT V2.1
PEB 3331 HT V2.1
Download Datasheet for PEB 3331 HT V2.1
Infineon Technologies
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 - - - - - - - - - - - - - Analog Voice Access - - - Parallel, PCM, Serial - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - PG-TQFP-100 - - - - - - - - - - -
Showing 3401-3450 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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