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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

4,360 active parts
37 manufacturers
25 distributors
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
MT89L80APR1
MT89L80APR1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 3V ~ 3.6V - -
MT89L85AN1
MT89L85AN1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-SSOP - - - - - - - - 3V ~ 3.6V - -
SI32260-C-GM1R
SI32260-C-GM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 60-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
MT89L85AP1
MT89L85AP1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 3V ~ 3.6V - -
PBL386112QNT
PBL386112QNT
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
LE87614MQCT
LE87614MQCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PEB 24902 H V2.1
PEB 24902 H V2.1
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Infineon Technologies
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 - - - - - 1mA - - - - - - - Echo Cancellation - - - ISDN - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 840 mW - - - - - - - - P-MQFP-64-9 - - - - - - - - 7V - -
MT8986APR1
MT8986APR1
Microchip Technology
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 - - - - - 10mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 4.75V ~ 5.25V - -
PEB 2466 H V2.2
PEB 2466 H V2.2
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Infineon Technologies
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 - - - - - 26mA - - - - - - - CODEC Filter - - - PCM, SPI - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 130 mW - - - - - - - - P-MQFP-64 - - - - - - - - 5V - -
MT90866AG2
MT90866AG2
Microchip Technology
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 - - - - - 480mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 344-PBGA (27x27) - - - - - - - - 3V ~ 3.6V - -
SI3019-F-GTR
SI3019-F-GTR
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Skyworks Solutions
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 - - - - - 8.5mA - - - - - - - Direct Access Arrangement (DAA) - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 16-TSSOP - - - - - - - - 3V ~ 3.6V - -
MT9042CPR1
MT9042CPR1
Microchip Technology
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 - - - - - 60mA - - - - - - - Digital Phase Locked Loop - - - - - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.5V ~ 5.5V - -
ZL38001DGE1
ZL38001DGE1
Microchip Technology
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 - - - - - 20mA - - - - - - - Telecom Circuit - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-SSOP - - - - - - - - 2.7V ~ 3.6V - -
ZL38001DGF1
ZL38001DGF1
Microchip Technology
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 - - - - - 20mA - - - - - - - Telecom Circuit - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-SSOP - - - - - - - - 2.7V ~ 3.6V - -
PEB 22554 HT V1.3
PEB 22554 HT V1.3
Download Datasheet for PEB 22554 HT V1.3
Infineon Technologies
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 - - - - - 330mA - - - - - - - Framer, Line Interface Unit (LIU) - - - E1, HDLC, J1, PCM, T1 - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - PG-TQFP-144-2 - - - - - - - - 3.13V ~ 3.46V - -
ZL38003GMG2
ZL38003GMG2
Microchip Technology
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 - - - - - - - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 81-CABGA (10x10) - - - - - - - - - - -
ZL38010DCE1
ZL38010DCE1
Microchip Technology
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 - - - - - 100µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - 3V ~ 3.6V - -
ZL38010DCF1
ZL38010DCF1
Microchip Technology
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 - - - - - 100µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - 3V ~ 3.6V - -
ZL38065GDG
ZL38065GDG
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 1.6V ~ 2V - -
ZL38065GDG2
ZL38065GDG2
Microsemi Corporation
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 1.6V ~ 2V - -
ZL38070GBG
ZL38070GBG
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 535-PBGA (31x31) - - - - - - - - 1.6V ~ 2V - -
ZL38070GBG2
ZL38070GBG2
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 535-PBGA (31x31) - - - - - - - - 1.6V ~ 2V - -
ZL49010DAA1
ZL49010DAA1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 8-PDIP - - - - - - - - 4.75V ~ 5.25V - -
ZL49020DAA1
ZL49020DAA1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - 500 mW - - - - - - - - 8-DIP - - - - - - - - 4.75V ~ 5.25V - -
ZL49021DAA1
ZL49021DAA1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 8-PDIP - - - - - - - - 4.75V ~ 5.25V - -
ZL49031DCF1
ZL49031DCF1
Microsemi Corporation
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 18-SOIC - - - - - - - - 4.75V ~ 5.25V - -
PEB 20954 HT V1.1
PEB 20954 HT V1.1
Download Datasheet for PEB 20954 HT V1.1
Infineon Technologies
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 - - - - - 350mA - - - - - - - Smart Integrated Digital Echo Canceller (SIDEC) - - - PCM, Serial, UCC - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 900 mW - - - - - - - - PG-MQFP-144-8 - - - - - - - - 3V ~ 3.6V - -
ZL49031DDE1
ZL49031DDE1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SSOP - - - - - - - - 4.75V ~ 5.25V - -
ZL50010/GDC
ZL50010/GDC
Microchip Technology
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 - - - - - 250mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 144-LBGA (13x13) - - - - - - - - 3V ~ 3.6V - -
ZL50010GDG2
ZL50010GDG2
Microchip Technology
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 - - - - - 250mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 144-LBGA (13x13) - - - - - - - - 3V ~ 3.6V - -
SI32282-A-GM
SI32282-A-GM
Download Datasheet for SI32282-A-GM
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 56-QFN (8x8) - - - - - - - - 3.3V - -
ZL50011QCG1
ZL50011QCG1
Microchip Technology
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 - - - - - 250mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 160-LQFP (24x24) - - - - - - - - 3V ~ 3.6V - -
PSB4450RV1.2
PSB4450RV1.2
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
ZL50015GAC
ZL50015GAC
Microchip Technology
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 - - - - - 150mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-PBGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50115GAG
ZL50115GAG
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL50115GAG2
ZL50115GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL50116GAG
ZL50116GAG
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL50116GAG2
ZL50116GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
LE88536PQCT
LE88536PQCT
Microchip Technology
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 - - - - - - - - - - - - - Battery Switch - - - 4-Wire Serial - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 48-QFN - - - - - - - - 3.3V ~ 35V - -
ZL50117GAG2
ZL50117GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL50118GAG
ZL50118GAG
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
ZL50118GAG2
ZL50118GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
PEB 20570 F V3.1
PEB 20570 F V3.1
Download Datasheet for PEB 20570 F V3.1
Infineon Technologies
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 - - - - - 272.6mA - - - - - - - Line Card Controller - - - ISDN - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3.13V ~ 3.47V - -
ZL50119GAG2
ZL50119GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 1.65V ~ 1.95V - -
SI32280-A-GM
SI32280-A-GM
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Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-QFN (7x7) - - - - - - - - 3.3V - -
ZL50211/GBC
ZL50211/GBC
Microsemi Corporation
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 535-PBGA (31x31) - - - - - - - - 1.6V ~ 2V - -
PEB 20542 F V1.3
PEB 20542 F V1.3
Download Datasheet for PEB 20542 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-LQFP-144-10 - - - - - - - - 3V ~ 3.6V - -
ZL50016GAC
ZL50016GAC
Microchip Technology
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 - - - - - 115mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -45°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50016QCG1
ZL50016QCG1
Microsemi Corporation
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 - - - - - 115mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -45°C ~ 85°C - - - - - - - - - - - - - - - 256-LQFP (28x28) - - - - - - - - 1.71V ~ 1.89V - -
PEB 20532 F V1.3
PEB 20532 F V1.3
Download Datasheet for PEB 20532 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3V ~ 3.6V - -
Showing 3301-3350 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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