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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

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37 manufacturers
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
PSB2132HV2.2
PSB2132HV2.2
Infineon Technologies
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 - - - - - 18mA - - - - - - - CODEC Filter - - - IOM-2 PCM, SPI - - - Surface Mount - 2 - - - - - - - - - 90 mW - - - - - - - - P-MQFP-64 - - - - - - - - 5V - -
MT9094AP1
MT9094AP1
Microchip Technology
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 - - - - - 6mA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC - - - - - - - - 4.75V ~ 5.25V - -
PEB 3086 F V1.4
PEB 3086 F V1.4
Download Datasheet for PEB 3086 F V1.4
Infineon Technologies
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 - - - - - 30mA - - - - - - - Subscriber Access Controller - - - HDLC, IOM-2, ISDN, Parallel, SCI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-64-1 - - - - - - - - 3.3V - -
MT9043ANR1
MT9043ANR1
Microchip Technology
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 - - - - - 50mA - - - - - - - Digital Phase Locked Loop - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-SSOP - - - - - - - - 3V ~ 3.6V - -
MT90812AL1
MT90812AL1
Microchip Technology
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 - - - - - 10mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 64-MQFP (14x20) - - - - - - - - 4.5V ~ 5.5V - -
MT90870AG
MT90870AG
Microchip Technology
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 - - - - - 160mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 272-PBGA (27x27) - - - - - - - - 3V ~ 3.6V - -
MT8888CP1
MT8888CP1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT89L80AP1
MT89L80AP1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 3V ~ 3.6V - -
PEB 3081 H V1.4
PEB 3081 H V1.4
Download Datasheet for PEB 3081 H V1.4
Infineon Technologies
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 - - - - - 30mA - - - - - - - S / T Bus Interface Transceiver - - - IOM-2, ISDN, SCI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - P-MQFP-44 - - - - - - - - 3.3V - -
MT8870DS1-1
MT8870DS1-1
Microchip Technology
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 - - - - - 3mA - - - - - - - DTMF Receiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 18-SOIC - - - - - - - - 4.75V ~ 5.25V - -
SI32179-B-FM1
SI32179-B-FM1
Download Datasheet for SI32179-B-FM1
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - - - -
PEB 3081 F V1.4
PEB 3081 F V1.4
Download Datasheet for PEB 3081 F V1.4
Infineon Technologies
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 - - - - - 30mA - - - - - - - S / T Bus Interface Transceiver - - - IOM-2, ISDN, SCI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-48 - - - - - - - - 3.3V - -
MT8880CN1
MT8880CN1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
MT8880CP1
MT8880CP1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT8880CPR1
MT8880CPR1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT8880CSR1
MT8880CSR1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
PEB 24911 H V1.3
PEB 24911 H V1.3
Download Datasheet for PEB 24911 H V1.3
Infineon Technologies
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 - - - - - - - - - - - - - Echo Cancellation - - - IOM-2, ISDN - - - Surface Mount - 4 - - - - - - - - - - - - - - - - - - P-MQFP-64 - - - - - - - - - - -
MT8885AN1
MT8885AN1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
MT8885ANR1
MT8885ANR1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
SI32260-C-GM1R
SI32260-C-GM1R
Download Datasheet for SI32260-C-GM1R
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 60-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
PBL386112QNT
PBL386112QNT
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
MT8888CSR1
MT8888CSR1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
LE87614MQCT
LE87614MQCT
Microchip Technology
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PEB 24902 H V2.1
PEB 24902 H V2.1
Download Datasheet for PEB 24902 H V2.1
Infineon Technologies
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 - - - - - 1mA - - - - - - - Echo Cancellation - - - ISDN - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 840 mW - - - - - - - - P-MQFP-64-9 - - - - - - - - 7V - -
PEB 2466 H V2.2
PEB 2466 H V2.2
Download Datasheet for PEB 2466 H V2.2
Infineon Technologies
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 - - - - - 26mA - - - - - - - CODEC Filter - - - PCM, SPI - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 130 mW - - - - - - - - P-MQFP-64 - - - - - - - - 5V - -
MT8889CSR1
MT8889CSR1
Microchip Technology
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 - - - - - 7mA - - - - - - - DTMF Transceiver - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT88E43BS1
MT88E43BS1
Microchip Technology
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 - - - - - 4.7mA - - - - - - - Telecom Circuit - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SOIC - - - - - - - - 2.7V ~ 5.5V - -
MT88E43BSR1
MT88E43BSR1
Microchip Technology
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 - - - - - 4.7mA - - - - - - - Telecom Circuit - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SOIC - - - - - - - - 2.7V ~ 5.5V - -
MT88E45BN1
MT88E45BN1
Microchip Technology
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 - - - - - 2.8mA - - - - - - - Telecom Circuit - - - 4-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SSOP - - - - - - - - 2.7V ~ 5.5V - -
MT88E45BNR1
MT88E45BNR1
Microsemi Corporation
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 - - - - - 2.8mA - - - - - - - Telecom Circuit - - - 4-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SSOP - - - - - - - - 2.7V ~ 5.5V - -
MT88E45BS1
MT88E45BS1
Microchip Technology
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 - - - - - 2.8mA - - - - - - - Telecom Circuit - - - 4-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 2.7V ~ 5.5V - -
MT88E45BSR1
MT88E45BSR1
Microchip Technology
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 - - - - - 2.8mA - - - - - - - Telecom Circuit - - - 4-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 2.7V ~ 5.5V - -
SI3019-F-GTR
SI3019-F-GTR
Download Datasheet for SI3019-F-GTR
Skyworks Solutions
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 - - - - - 8.5mA - - - - - - - Direct Access Arrangement (DAA) - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 16-TSSOP - - - - - - - - 3V ~ 3.6V - -
MT88E46ASR1
MT88E46ASR1
Microchip Technology
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 - - - - - 4.3mA - - - - - - - Telecom Circuit - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 2.7V ~ 5.5V - -
MT88L70AE1
MT88L70AE1
Microchip Technology
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 - - - - - 2mA - - - - - - - DTMF Receiver - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 18-PDIP - - - - - - - - 2.7V ~ 3.6V - -
MT8964AE1
MT8964AE1
Microchip Technology
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Through Hole - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 18-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT89L85APR1
MT89L85APR1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 3V ~ 3.6V - -
MT88L85AE1
MT88L85AE1
Microchip Technology
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 - - - - - 3.1mA - - - - - - - DTMF Transceiver - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-PDIP - - - - - - - - 2.7V ~ 3.6V - -
BCM56338B1IFSBLG
BCM56338B1IFSBLG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PEB 22554 HT V1.3
PEB 22554 HT V1.3
Download Datasheet for PEB 22554 HT V1.3
Infineon Technologies
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 - - - - - 330mA - - - - - - - Framer, Line Interface Unit (LIU) - - - E1, HDLC, J1, PCM, T1 - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - PG-TQFP-144-2 - - - - - - - - 3.13V ~ 3.46V - -
MT8966AS1
MT8966AS1
Microchip Technology
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
PEB 20954 HT V1.1
PEB 20954 HT V1.1
Download Datasheet for PEB 20954 HT V1.1
Infineon Technologies
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 - - - - - 350mA - - - - - - - Smart Integrated Digital Echo Canceller (SIDEC) - - - PCM, Serial, UCC - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 900 mW - - - - - - - - PG-MQFP-144-8 - - - - - - - - 3V ~ 3.6V - -
SI32282-A-GM
SI32282-A-GM
Download Datasheet for SI32282-A-GM
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 56-QFN (8x8) - - - - - - - - 3.3V - -
MT8979AE1
MT8979AE1
Microchip Technology
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 - - - - - 8mA - - - - - - - Transceiver - - - PCM - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PDIP - - - - - - - - 4.5V ~ 5.5V - -
MT8979AP1
MT8979AP1
Microchip Technology
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 - - - - - 8mA - - - - - - - Transceiver - - - PCM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC - - - - - - - - 4.5V ~ 5.5V - -
MT8979APR1
MT8979APR1
Microsemi Corporation
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 - - - - - 8mA - - - - - - - Transceiver - - - PCM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC - - - - - - - - 4.5V ~ 5.5V - -
ZL38002DGE1
ZL38002DGE1
Microchip Technology
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 - - - - - 20mA - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 90 mW - - - - - - - - 36-QSOP - - - - - - - - 2.7V ~ 3.6V - -
ZL38002QDG1
ZL38002QDG1
Microchip Technology
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 - - - - - 20mA - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 90 mW - - - - - - - - 48-TQFP (7x7) - - - - - - - - 2.7V ~ 3.6V - -
PSB4450RV1.2
PSB4450RV1.2
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PEB 20570 F V3.1
PEB 20570 F V3.1
Download Datasheet for PEB 20570 F V3.1
Infineon Technologies
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 - - - - - 272.6mA - - - - - - - Line Card Controller - - - ISDN - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3.13V ~ 3.47V - -
Showing 3251-3300 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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