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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

4,360 active parts
37 manufacturers
25 distributors
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
PEB 22554 HT V1.3
PEB 22554 HT V1.3
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Infineon Technologies
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 - - - - - 330mA - - - - - - - Framer, Line Interface Unit (LIU) - - - E1, HDLC, J1, PCM, T1 - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - PG-TQFP-144-2 - - - - - - - - 3.13V ~ 3.46V - -
ZL50017GAG2
ZL50017GAG2
Microchip Technology
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 - - - - - 75mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50017QCG1
ZL50017QCG1
Microsemi Corporation
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 - - - - - 75mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-LQFP (28x28) - - - - - - - - 1.71V ~ 1.89V - -
ZL50018GAC
ZL50018GAC
Microchip Technology
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 - - - - - 165mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
PEB 20954 HT V1.1
PEB 20954 HT V1.1
Download Datasheet for PEB 20954 HT V1.1
Infineon Technologies
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 - - - - - 350mA - - - - - - - Smart Integrated Digital Echo Canceller (SIDEC) - - - PCM, Serial, UCC - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - 900 mW - - - - - - - - PG-MQFP-144-8 - - - - - - - - 3V ~ 3.6V - -
ZL50019GAC
ZL50019GAC
Microchip Technology
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 - - - - - 165mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
SI32282-A-GM
SI32282-A-GM
Download Datasheet for SI32282-A-GM
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 56-QFN (8x8) - - - - - - - - 3.3V - -
ZL50020GAC
ZL50020GAC
Microchip Technology
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 - - - - - 120mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50021GAC
ZL50021GAC
Microchip Technology
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 - - - - - 1.75mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50021GAG2
ZL50021GAG2
Microchip Technology
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 - - - - - 1.75mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50023GAC
ZL50023GAC
Microchip Technology
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 - - - - - 130mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50030GAC
ZL50030GAC
Microchip Technology
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 - - - - - 480mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 220-BGA (17x17) - - - - - - - - 3V ~ 3.6V - -
ZL50030GAG2
ZL50030GAG2
Microchip Technology
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 - - - - - 480mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 220-BGA (17x17) - - - - - - - - 3V ~ 3.6V - -
ZL50050GAC
ZL50050GAC
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 196-PBGA (15x15) - - - - - - - - 1.71V ~ 1.89V - -
ZL50050GAG2
ZL50050GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 196-PBGA (15x15) - - - - - - - - 1.71V ~ 1.89V - -
ZL50051GAC
ZL50051GAC
Microsemi Corporation
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50051GAG2
ZL50051GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA - - - - - - - - 1.71V ~ 1.89V - -
ZL50052GAC
ZL50052GAC
Microsemi Corporation
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 196-PBGA (15x15) - - - - - - - - 1.71V ~ 1.89V - -
ZL50057GAC
ZL50057GAC
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 272-PBGA (27x27) - - - - - - - - 1.71V ~ 1.89V - -
ZL50058GAC
ZL50058GAC
Microsemi Corporation
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50058GAG2
ZL50058GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50060GAC
ZL50060GAC
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50061GAG
ZL50061GAG
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 272-PBGA (27x27) - - - - - - - - 1.71V ~ 1.89V - -
ZL50211GBG2
ZL50211GBG2
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 535-PBGA (31x31) - - - - - - - - 1.6V ~ 2V - -
PSB4450RV1.2
PSB4450RV1.2
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
ZL50232/GDC
ZL50232/GDC
Microchip Technology
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 - - - - - 10mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 1.6V ~ 2V - -
PEB 20570 F V3.1
PEB 20570 F V3.1
Download Datasheet for PEB 20570 F V3.1
Infineon Technologies
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 - - - - - 272.6mA - - - - - - - Line Card Controller - - - ISDN - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3.13V ~ 3.47V - -
ZL50234/GDC
ZL50234/GDC
Microsemi Corporation
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 - - - - - 22mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 1.6V ~ 2V - -
ZL79124GDG
ZL79124GDG
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 144-BGA - - - - - - - - - - -
ZL79234GDG
ZL79234GDG
Microsemi Corporation
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 - - - - - - - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 144-BGA - - - - - - - - - - -
ZL792388GDG
ZL792388GDG
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 196-BGA - - - - - - - - - - -
ZL50061GAG2
ZL50061GAG2
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 272-PBGA (27x27) - - - - - - - - 1.71V ~ 1.89V - -
ZL50062GAC
ZL50062GAC
Microsemi Corporation
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-BGA (17x17) - - - - - - - - 1.71V ~ 1.89V - -
ZL50063GAC
ZL50063GAC
Microsemi Corporation
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 196-PBGA (15x15) - - - - - - - - 1.71V ~ 1.89V - -
ZL50064QCG1
ZL50064QCG1
Microchip Technology
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 - - - - - 240mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-LQFP (28x28) - - - - - - - - 1.71V ~ 1.89V - -
ZL50070GAC
ZL50070GAC
Microsemi Corporation
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 - - - - - 500mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 484-PBGA (23x23) - - - - - - - - 1.71V ~ 1.89V - -
SI32280-A-GM
SI32280-A-GM
Download Datasheet for SI32280-A-GM
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-QFN (7x7) - - - - - - - - 3.3V - -
PEB 20542 F V1.3
PEB 20542 F V1.3
Download Datasheet for PEB 20542 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-LQFP-144-10 - - - - - - - - 3V ~ 3.6V - -
PEB 20532 F V1.3
PEB 20532 F V1.3
Download Datasheet for PEB 20532 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3V ~ 3.6V - -
ZL50074GAG2
ZL50074GAG2
Microchip Technology
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 - - - - - 500mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 484-PBGA (23x23) - - - - - - - - 1.71V ~ 1.89V - -
BU8766FV-E2
BU8766FV-E2
Download Datasheet for BU8766FV-E2
ROHM Semiconductor
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 - - - - - - - - - - - - - Tone Generator - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 450 mW - - - - - - - - 16-SSOP-B - - - - - - - - 2.2V ~ 3.6V - -
ZL50110GAG
ZL50110GAG
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 552-PBGA (35x35) - - - - - - - - 1.65V ~ 1.95V - -
ZL50110GAG2
ZL50110GAG2
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 552-PBGA (35x35) - - - - - - - - 1.65V ~ 1.95V - -
ZL50111GAG
ZL50111GAG
Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - TDM - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 552-PBGA (35x35) - - - - - - - - 1.65V ~ 1.95V - -
MC33215BE
MC33215BE
Freescale Semiconductor
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 - - - - - - - - - - - - - Voice-Switched Speakerphone - - - - - - - Through Hole - 1 - - -20°C ~ 70°C - - - - - - - - - - - - - - - 42-PDIP - - - - - - - - - - -
BCM56440TB0KFSBLG
BCM56440TB0KFSBLG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
VSC8552XKS-02
VSC8552XKS-02
Download Datasheet for VSC8552XKS-02
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - - - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 256-PBGA (17x17) - - - - - - - - 1V - -
PEB 20525 F V1.3
PEB 20525 F V1.3
Download Datasheet for PEB 20525 F V1.3
Infineon Technologies
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 - - - - - 50mA - - - - - - - Serial Optimized Communications Controller - - - HDLC, PPP - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - 150 mW - - - - - - - - PG-TQFP-100-3 - - - - - - - - 3V ~ 3.6V - -
ZL38003GMG
ZL38003GMG
Microchip Technology
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 - - - - - - - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 81-CABGA (10x10) - - - - - - - - - - -
PEB 20256 E V2.2
PEB 20256 E V2.2
Download Datasheet for PEB 20256 E V2.2
Infineon Technologies
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 - - - - - 200mA - - - - - - - Network Controller - - - HDLC, PPP, SS7, TMA - - - Surface Mount - - - - 0°C ~ 70°C - - - - - - 3 W - - - - - - - - PG-BGA-388-2 - - - - - - - - 3V ~ 3.6V - -
Showing 3351-3400 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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