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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

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37 manufacturers
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
MT9123AP1
MT9123AP1
Microchip Technology
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 - - - - - 50mA - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC (11.51x11.51) - - - - - - - - 4.5V ~ 5.5V - -
MT9126AE1
MT9126AE1
Microchip Technology
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 - - - - - 5mA - - - - - - - Telecom Circuit - - - - - - - Through Hole - 4 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PDIP - - - - - - - - 4.5V ~ 5.5V - -
PBL38640/2SOA
PBL38640/2SOA
Lantiq
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 - - - - - 2.8mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 730 mW - - - - - - - - PG-DSO-24 - - - - - - - - 5V - -
MT9126ASR1
MT9126ASR1
Microchip Technology
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 - - - - - 5mA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - 4.5V ~ 5.5V - -
MT9160BS1
MT9160BS1
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Microchip Technology
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 - - - - - 4µA - - - - - - - CODEC - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT9162AN1
MT9162AN1
Microchip Technology
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 - - - - - 4µA - - - - - - - CODEC - - - SSI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SSOP - - - - - - - - 4.75V ~ 5.25V - -
MT9171AN1
MT9171AN1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
PBL38650/2QNT
PBL38650/2QNT
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Infineon Technologies
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 - - - - - 2.8mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 730 mW - - - - - - - - P/PG-LCC-28-3 - - - - - - - - 5V - -
MT9171APR1
MT9171APR1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT9172ANR1
MT9172ANR1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
PBL38650/2QNS
PBL38650/2QNS
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Infineon Technologies
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 - - - - - 2.8mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 730 mW - - - - - - - - P/PG-LCC-28-3 - - - - - - - - 5V - -
SI32297-A-FMR
SI32297-A-FMR
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Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
MT9173AE
MT9173AE
Microsemi Corporation
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT9173AE1
MT9173AE1
Microsemi Corporation
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT9173AN1
MT9173AN1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
MT9173ANR1
MT9173ANR1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
PBL38650/2QNA
PBL38650/2QNA
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Infineon Technologies
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 - - - - - 2.8mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 730 mW - - - - - - - - P/PG-LCC-28-3 - - - - - - - - 5V - -
MT9174AN1
MT9174AN1
Microchip Technology
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 - - - - - 10mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-SSOP - - - - - - - - 4.75V ~ 5.25V - -
MT9196AE1
MT9196AE1
Microchip Technology
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 - - - - - 400µA - - - - - - - Telecom Circuit - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT9196AP1
MT9196AP1
Microchip Technology
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 - - - - - 400µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT9196ASR1
MT9196ASR1
Microchip Technology
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 - - - - - 400µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT93L04AG
MT93L04AG
Microchip Technology
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 - - - - - 65µA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 365-BGA (27x27) - - - - - - - - 3V ~ 3.6V - -
MT93L04AG2
MT93L04AG2
Microchip Technology
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 - - - - - 65µA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 365-BGA (27x27) - - - - - - - - 3V ~ 3.6V - -
MT93L16AQ1
MT93L16AQ1
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Microchip Technology
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 - - - - - 3µA - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-QSOP - - - - - - - - 2.7V ~ 3.6V - -
ZL30301GAG
ZL30301GAG
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Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 3V ~ 3.6V - -
BCM56443TB0KFSBLG
BCM56443TB0KFSBLG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
ZL30302GAG
ZL30302GAG
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Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 3V ~ 3.6V - -
ZL30302GAG2
ZL30302GAG2
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Microchip Technology
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 - - - - - 950mA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 324-PBGA (23x23) - - - - - - - - 3V ~ 3.6V - -
MT9196AS1
MT9196AS1
Microchip Technology
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 - - - - - 400µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT9196APR1
MT9196APR1
Microchip Technology
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 - - - - - 400µA - - - - - - - Telecom Circuit - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
MT9123APR1
MT9123APR1
Microchip Technology
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 - - - - - 50mA - - - - - - - Echo Cancellation - - - Serial - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.5V ~ 5.5V - -
MT9162AS
MT9162AS
Microsemi Corporation
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 - - - - - 4µA - - - - - - - CODEC - - - SSI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT93L00AV
MT93L00AV
Microsemi Corporation
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 - - - - - 65mA - - - - - - - Echo Cancellation - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 208-LBGA (17x17) - - - - - - - - 3V ~ 3.6V - -
SI32170-B-GM1R
SI32170-B-GM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - - - -
SI32170-B-FM1
SI32170-B-FM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - - - -
SI32170-B-FM1R
SI32170-B-FM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - - - -
SI32170-B-GM1
SI32170-B-GM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - - - -
SI32172-C-GM1
SI32172-C-GM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32172-C-GM1R
SI32172-C-GM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32173-C-FM1R
SI32173-C-FM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32173-C-GM1
SI32173-C-GM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32175-C-FM1
SI32175-C-FM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32175-C-FM1R
SI32175-C-FM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32175-C-GM1
SI32175-C-GM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32175-C-GM1R
SI32175-C-GM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - ISI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
SI32177-C-FM1
SI32177-C-FM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.3V - -
BCM56445B0KFSLG
BCM56445B0KFSLG
Broadcom Limited
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SI32177-C-FM1R
SI32177-C-FM1R
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.3V - -
SI32177-C-GM1R
SI32177-C-GM1R
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.3V - -
PBL38640/2SOT
PBL38640/2SOT
Download Datasheet for PBL38640/2SOT
Infineon Technologies
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 - - - - - 2.8mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 730 mW - - - - - - - - PG-DSO-24-8 - - - - - - - - 5V - -
Showing 3501-3550 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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