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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

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37 manufacturers
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
SI32281-A-GM
SI32281-A-GM
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Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire, PCM - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-QFN (7x7) - - - - - - - - 3.3V - -
HC55121IM
HC55121IM
Harris Semiconductor
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 - - - - - 2.25mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 1.5 W - - - - - - - - 28-PLCC (11.51x11.51) - - - - - - - - 4.75V ~ 5.25V - -
PEB 4265 T V1.2
PEB 4265 T V1.2
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Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - P-DSO-20-5 - - - - - - - - 5V - -
LE79R79-3DJCT
LE79R79-3DJCT
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Microchip Technology
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 2-Wire - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 32-PLCC (11.43x13.97) - - - - - - - - 4.75V ~ 5.25V - -
LE8577LFJCT
LE8577LFJCT
Microchip Technology
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BCM5666KPBG
BCM5666KPBG
Broadcom Limited
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LE87213AFQCT
LE87213AFQCT
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Microsemi Corporation
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 - - - - - - - - - - - - - Driver - - - - - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 32-QFN (8x8) - - - - - - - - 3.3V - -
LE87220KQCT
LE87220KQCT
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Microchip Technology
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 - - - - - - - - - - - - - Driver - - - - - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-QFN (6x6) - - - - - - - - 3.3V - -
LE87251NQCT
LE87251NQCT
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Microchip Technology
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 - - - - - 4mA - - - - - - - Driver - - - - - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 16-QFN (4x4) - - - - - - - - 10V ~ 24V, ±5V ~ 12V - -
LE88004KSCT
LE88004KSCT
Microchip Technology
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 - - - - - 10mA - - - - - - - Translator - - - SPI - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 16-SOIC - - - - - - - - 3.3V - -
PEB 4265-2 T V1.2
PEB 4265-2 T V1.2
Download Datasheet for PEB 4265-2 T V1.2
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - P-DSO-20-5 - - - - - - - - 5V - -
SI32293-A-GMR
SI32293-A-GMR
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Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
PEB 4264 V V1.2
PEB 4264 V V1.2
Download Datasheet for PEB 4264 V V1.2
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - PG-VQFN-48-4 - - - - - - - - 3.3V ~ 5V - -
LE7942B-2DJCT
LE7942B-2DJCT
Download Datasheet for LE7942B-2DJCT
Microchip Technology
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 2-Wire - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 32-PLCC (11.43x13.97) - - - - - - - - 4.75V ~ 5.25V - -
PEB 4264 T V1.2
PEB 4264 T V1.2
Download Datasheet for PEB 4264 T V1.2
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - P-DSO-20-5 - - - - - - - - 3.3V ~ 5V - -
BCM56680B1IFSB
BCM56680B1IFSB
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
SI32291-A-GMR
SI32291-A-GMR
Download Datasheet for SI32291-A-GMR
Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
PEF2026T-PV1.1
PEF2026T-PV1.1
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
SI32182-A-FMR
SI32182-A-FMR
Download Datasheet for SI32182-A-FMR
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 36-QFN (5x6) - - - - - - - - 3.3V - -
VSC7110XJW
VSC7110XJW
Microchip Technology
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 - - - - - - - - - - - - - Signal Conditioner - - - - - - - Surface Mount - 2 - - -40°C ~ 110°C - - - - - - - - - - - - - - - 32-QFN (5x5) - - - - - - - - 2.5V - -
LE88131BLC
LE88131BLC
Microchip Technology
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 44-eLQFP - - - - - - - - 3V, 5V - -
PEB 3324 HL V1.4
PEB 3324 HL V1.4
Download Datasheet for PEB 3324 HL V1.4
Infineon Technologies
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 - - - - - - - - - - - - - Analog Voice Access - - - ADPCM - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - 400 mW - - - - - - - - PG-LQFP-176-2 - - - - - - - - - - -
SI32174-C-GM1
SI32174-C-GM1
Download Datasheet for SI32174-C-GM1
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
MT8920BPR1
MT8920BPR1
Microchip Technology
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 - - - - - 10µA - - - - - - - Telecom Circuit - - - Parallel - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC - - - - - - - - 4.75V ~ 5.25V - -
PEB 3324 E V1.4
PEB 3324 E V1.4
Download Datasheet for PEB 3324 E V1.4
Infineon Technologies
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 - - - - - - - - - - - - - Analog Voice Access - - - ADPCM - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - 400 mW - - - - - - - - PG-LBGA-176 - - - - - - - - - - -
MT8952BE1
MT8952BE1
Microchip Technology
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 - - - - - 1µA - - - - - - - Controller - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT8952BP1
MT8952BP1
Microchip Technology
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 - - - - - 1µA - - - - - - - Controller - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 28-PLCC (11.51x11.51) - - - - - - - - 4.75V ~ 5.25V - -
MT8960AE1
MT8960AE1
Microchip Technology
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Through Hole - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 18-PDIP - - - - - - - - 4.75V ~ 5.25V - -
PEB 3265 H V1.5
PEB 3265 H V1.5
Download Datasheet for PEB 3265 H V1.5
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - P-MQFP-64-1 - - - - - - - - 3.3V - -
MT8962AE1
MT8962AE1
Microchip Technology
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Through Hole - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 20-PDIP - - - - - - - - 4.75V ~ 5.25V - -
SI32170-C-GM1
SI32170-C-GM1
Download Datasheet for SI32170-C-GM1
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 750 mW - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.13V ~ 3.47V - -
LE88216DLCT
LE88216DLCT
Microsemi Corporation
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 - - - - - - - - - - - - - Telecom Circuit - - - PCM - - - Surface Mount - 2 - - - - - - - - - - - - - - - - - - 80-eLQFP - - - - - - - - - - -
PBL38627/2SOTR2B
PBL38627/2SOTR2B
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
MT8963AE1
MT8963AE1
Microchip Technology
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Through Hole - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 20-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT8963AS1
MT8963AS1
Microsemi Corporation
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
MT8963ASR1
MT8963ASR1
Microsemi Corporation
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 - - - - - 3mA - - - - - - - PCM CODEC - - - PCM - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 20-SOIC - - - - - - - - 4.75V ~ 5.25V - -
PEB 3265 F V1.5
PEB 3265 F V1.5
Download Datasheet for PEB 3265 F V1.5
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-64-1 - - - - - - - - 3.3V - -
MT8981DE1
MT8981DE1
Microchip Technology
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 - - - - - 6mA - - - - - - - Switch - - - - - - - Through Hole - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 40-PDIP - - - - - - - - 4.75V ~ 5.25V - -
MT8981DP1
MT8981DP1
Microchip Technology
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 - - - - - 6mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 4.75V ~ 5.25V - -
MT8981DPR1
MT8981DPR1
Microchip Technology
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 - - - - - 6mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-PLCC (16.51x16.51) - - - - - - - - 4.75V ~ 5.25V - -
PEB 3264 H V1.4
PEB 3264 H V1.4
Download Datasheet for PEB 3264 H V1.4
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - P-MQFP-64-1 - - - - - - - - 3.3V - -
MT89L80AN1
MT89L80AN1
Microchip Technology
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 - - - - - 4mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-SSOP - - - - - - - - 3V ~ 3.6V - -
SI32261-C-FM2
SI32261-C-FM2
Download Datasheet for SI32261-C-FM2
Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 60-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
MT8985AL1
MT8985AL1
Microchip Technology
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 - - - - - 10mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-MQFP (10x10) - - - - - - - - 4.75V ~ 5.25V - -
PEB 3264 F V1.4
PEB 3264 F V1.4
Download Datasheet for PEB 3264 F V1.4
Infineon Technologies
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 - - - - - 105mA - - - - - - - Dual Channel Subscriber Line Interface Circuit (DuSLIC) - - - IOM-2, PCM - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-64-1 - - - - - - - - 3.3V - -
PEB3165FV11XT
PEB3165FV11XT
Download Datasheet for PEB3165FV11XT
Infineon Technologies
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 - - - - - - - - - - - - - Subscriber Line Interface CODEC Filter (SLICOFI) - - - - - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - PG-TQFP-64-1 - - - - - - - - - - -
BCM68462A1KFEBG
BCM68462A1KFEBG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
MT8986AL1
MT8986AL1
Microchip Technology
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 - - - - - 10mA - - - - - - - Switch - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 44-MQFP (10x10) - - - - - - - - 4.75V ~ 5.25V - -
PBL3766/1NS
PBL3766/1NS
Infineon Technologies
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 2-Wire - - - Through Hole - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 22-DIP - - - - - - - - -24V ~ -58V - -
VSC8486YSN-04
VSC8486YSN-04
Download Datasheet for VSC8486YSN-04
Microchip Technology
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 - - - - - - - - - - - - - Transceiver - - - Serial - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 256-FCBGA (17x17) - - - - - - - - 1.2V - -
Showing 3151-3200 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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