EVM-LEADLESS1 EVALUATION MODULE
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EVM-LEADLESS1

Mfr Name: Texas Instruments
Texas Instruments
EVALUATION MODULE
Stock on Request

EVM-LEADLESS1 Specifications Quick View

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EVM-LEADLESS1 Description

Short technical summary and product information.
EVALUATION MODULE

EVM-LEADLESS1 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EVM-LEADLESS1 Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
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20-350000-11-RC-P
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This Aries Electronics adapter converts SOIC packages to DIP format, featuring 20 positions and a 0.300 inch center spacing. It is constructed with FR4 board material.
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16-350000-10
16-350000-10
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This Aries Electronics 16-350000-10 adapter converts SOIC packages to DIP format. It supports 16 positions with a 0.300" center spacing.
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08-350000-10
08-350000-10
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This Aries Electronics 08-350000-10 is an SOIC to DIP socket adapter with 8 positions and 0.3" row spacing. It features through-hole mounting.
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28-650000-10
28-650000-10
Aries Electronics
The Aries Electronics 28-650000-10 is an adapter designed to convert SOIC packages to DIP. It offers 28 positions and is constructed with FR4 board material.
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