| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,748 pcs
|
3748 pcs | On Request | 1 | On Request | On Request | 20＋ | On Request | On Request | |
|
3,748 pcs
|
3748 pcs | On Request | 1 | On Request | On Request | 20＋ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type |
This Samsung K4F8E3S4HB-MHCJ is a DRAM component designed for various memory applications. It comes in a FBGA-200 package, suitable for surface mount assembly.
The component is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 3. While specific operating voltage, data rate, memory size, interface, and supply voltage are not detailed here, its classification as DRAM indicates its function within memory systems.
The FBGA-200 package is designed for surface mounting, requiring appropriate PCB footprint and assembly processes. This component is part of the broader memory solutions offered by Samsung Electronics.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.20 | $10.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The K4F8E3S4HB-MHCJ comes in an FBGA-200 package.
The K4F8E3S4HB-MHCJ is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the K4F8E3S4HB-MHCJ is MSL 3.
The REACH status for the K4F8E3S4HB-MHCJ is REACH Unaffected.
.webp)
