Molex

<p>The Molex 5600200320 is a 3-position, single-row header from the DuraClik 2.00mm wire-to-board connector system. It features a shrouded 4-wall design with latch lock fastening for secure mating. The header is surface mount (SMT) with solder termination and includes solder retention features for reliable PCB attachment.</p><p>&nbsp;</p><p>This header uses square, tin-plated male pins made of copper alloy. The insulation is natural polyamide (nylon) with an insulation height of 8.00mm. It is designed for board-to-cable/wire applications and is rated for operating temperatures up to 105°C.</p><p>&nbsp;</p><p>The DuraClik series is suitable for automotive passenger compartment and other high-vibration environments, offering design flexibility with various circuit options and configurations.</p>

<p>The Molex 2078450004 is a Terminal Position Assurance (TPA) accessory designed for use with the L1NK 250 series connector system. This TPA features 4 positions and ensures proper terminal retention and alignment. It is compliant with RoHS3, REACH, and has an MSL rating of 1 (unlimited). The TPA is a key component for reliable connector mating in various applications.</p>

<p>The Molex 5051510801 is a DuraClik series wire-to-board receptacle housing designed for 2.00mm pitch applications. It features 8 positions in a single row with a female socket contact type. The housing uses a latch lock mechanism for secure mating and is intended for free hanging (in-line) mounting.</p><p>&nbsp;</p><p>This housing accepts crimp termination contacts and is rated for an operating temperature range of -40°C to 125°C. The housing is white in color and is specified as RoHS3 compliant, REACH unaffected, with an MSL of 1 (unlimited).</p><p>&nbsp;</p><p>The DuraClik family is commonly used in automotive, industrial, and consumer electronics where a compact and reliable wire-to-board connection is required. The 2.00mm pitch allows for a moderate density interconnect suitable for signal and low power applications.</p>

<p>The Molex 90800-0014 is a 1.27mm pitch right angle pin header from the 90800 series. It features a low profile staggered design for compact PCB layouts. The header is through-hole mounted with solder termination, ensuring reliable connections. It is RoHS3 compliant, REACH unaffected, and has an MSL rating of 1 (unlimited). The part is suitable for applications requiring high-density interconnects.</p>

<p>The Molex 5051100897 is an FPC (Flexible Printed Circuit) connector featuring 8 contacts arranged at a 0.5mm pitch. It utilizes a ZIF (Zero Insertion Force) actuation mechanism with a bottom contact design, allowing for easy and reliable connection of flexible circuits without damaging the contacts. The connector is surface mount compatible with solder termination, making it suitable for automated assembly processes.</p><p>&nbsp;</p><p>This connector is packaged in embossed tape on reel, facilitating pick-and-place manufacturing. It is designed for compact electronic devices where space is at a premium, such as mobile phones, tablets, and wearables. The ZIF design ensures secure retention of the FPC while enabling repeated mating cycles.</p><p>&nbsp;</p><p>The 5051100897 is RoHS3 compliant and REACH unaffected, with an MSL (Moisture Sensitivity Level) of 1, indicating unlimited floor life. These compliance attributes support use in environmentally conscious designs.</p>

<p>The Molex 5025790000 is a stamped crimp contact designed for use with 24 to 28 AWG wires. It features a non-gendered design, allowing flexible mating options. The contact is terminated via crimping and is finished with tin plating (16.0µin thickness) for reliable conductivity and corrosion resistance. This contact is suitable for various rectangular connector systems where compact and secure wire connections are required.</p>

<p>The Molex 39-00-0217 is a female crimp contact from the Mini-Fit series, designed for use in rectangular connector systems. The contact is made of brass with tin plating, providing reliable conductivity and corrosion resistance. Termination is via crimp, ensuring secure attachment to wires. This part is supplied in tape and reel packaging, suitable for automated assembly processes. While the Mini-Fit series is known for power and signal applications, specific electrical ratings for this contact are not provided in the available data. The contact is intended for use with compatible Mini-Fit housings and headers.</p>

<p>The Molex Picoflex 0923151207 is a 12-position, single-row rectangular cable assembly featuring IDC (Insulation Displacement Connector) termination on both ends in a socket-to-socket configuration. The cable is a gray ribbon type with a 70.00mm length (approximately 2.76 inches) and a 1.27mm (0.050 inch) pitch between contacts. Connectors are unshielded and the contacts have a tin-plated finish with a thickness of 80.0 microinches (2.03 micrometers). This assembly is part of the Molex Picoflex family, known for compact, low-profile interconnects suitable for dense wiring applications. It is designed to interface with matching Picoflex headers for reliable signal transmission in a variety of electronic systems. The materials are RoHS3 compliant and the component is rated for an MSL (Moisture Sensitivity Level) of 1 (unlimited). Note that compliance data is unverified.</p>

<p>The Molex 5054481671 is a 16-position, 2-row header connector designed for board-to-cable/wire applications. It features a 1.25mm pitch and a surface mount, right angle termination style, making it suitable for compact, low-profile PCB designs. The header is fully shrouded with a 4-wall design and includes a latch holder for secure mating with corresponding receptacles. Contacts are made of brass with a tin finish (39.4µin thickness) and have a square shape. The insulation is black polyamide (nylon) with a flammability rating of UL94 V-0, and the insulation height is 8.95mm. The connector is rated for 50V AC/DC and has an operating temperature range of -40°C to 105°C. Current rating varies by wire gauge. Additional features include pick and place capability and solder retention for automated assembly.</p>