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XCZU7EV-1FBVB900E The Advanced Micro Devices XCZU7EV-1FBVB900E is a System On Chip (SoC) featuring Quad ARM Cortex-A53, Dual ARM Cortex-R5, and ARM Mali-400 MP2 processors. It operates within a temperature range of 0°C to 100°C (TJ) and comes in a 900-FCBGA package.
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XCZU7EV-1FBVB900E

Available from 1 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The Advanced Micro Devices XCZU7EV-1FBVB900E is a System On Chip (SoC) featuring Quad ARM Cortex-A53, Dual ARM Cortex-R5, and ARM Mali-400 MP2 processors. It operates within a temperature range of 0°C to 100°C (TJ) and comes in a 900-FCBGA package.
✓ Total Stock: 270 pcs
$ Price Range: $0.99

XCZU7EV-1FBVB900E Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Braun Electronic Components ✓
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270 pcs
On Request
270 pcs On Request 1 On Request On Request On Request On Request On Request
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XCZU7EV-1FBVB900E Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Architecture
Connectivity
Core Processor
Operating Temperature
Peripherals
Primary Attributes
RAM Size
Speed
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XCZU7EV-1FBVB900E Description

Short technical summary and product information.

The XCZU7EV-1FBVB900E from Advanced Micro Devices is an embedded System On Chip (SoC) belonging to the Zynq UltraScale+ family. This device integrates multiple processing cores, including Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, and an ARM Mali-400 MP2 graphics processor.

 

Key technical specifications include a speed range of 500MHz, 600MHz, and 1.2GHz, and 256KB of RAM. It offers extensive connectivity options such as CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The device is designed for embedded applications requiring high processing power and flexibility.

 

Packaged in a 900-FCBGA (31x31) format, the XCZU7EV-1FBVB900E operates within a temperature range of 0°C to 100°C (TJ). It is classified as RoHS3 Compliant, with an MSL of 1 (Unlimited), and REACH Unaffected. This SoC is suitable for complex embedded systems and advanced computing tasks.

XCZU7EV-1FBVB900E Quick Information

Product Type: System On Chip (SoC)
Series: MPSoC
Canonical Name: Xilinx Zynq UltraScale+ MPSoC XCZU7EV-1FBVB900E
Subcategory: Embedded

XCZU7EV-1FBVB900E Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XCZU7EV-1FBVB900E Estimated Pricing

Qty Low High
1+ $0.99 $0.99

Estimated market price range - modelled values for guidance only, not live distributor offers.

XCZU7EV-1FBVB900E Features

  • Integrated ARM Cortex-A53, R5, and Mali-400 MP2.
  • Supports speeds up to 1.2GHz.
  • Offers extensive connectivity options.
  • Packaged in 900-FCBGA.
  • RoHS3 compliant with MSL 1.

XCZU7EV-1FBVB900E Applications

  • Embedded system development with FPGA integration
  • Industrial automation control systems
  • High-performance communication modules
  • Data processing in embedded applications

XCZU7EV-1FBVB900E FAQs

5 frequently asked questions generated from this part’s specifications.
What is the operating temperature range for the XCZU7EV-1FBVB900E?

The operating temperature range is 0°C to 100°C (TJ).

What package type is the XCZU7EV-1FBVB900E?

The package type is 900-BBGA, FCBGA.

What are the core processors in the XCZU7EV-1FBVB900E?

It features Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2.

What is the RAM size of the XCZU7EV-1FBVB900E?

The RAM size is 256KB.

What connectivity options are available on the XCZU7EV-1FBVB900E?

Connectivity options include CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

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