| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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18 pcs
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18 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The AMD XCZU4EV-1FBVB900E is a heterogeneous System On Chip (SoC) from the Zynq® UltraScale+™ MPSoC EV series. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit.
This device boasts a Zynq® UltraScale+™ FPGA fabric with over 192,000 logic cells, capable of operating at clock speeds up to 1.2GHz. It includes 256KB of RAM and supports various connectivity options such as CANbus, Ethernet, I²C, SPI, UART/USART, and USB OTG, along with peripherals like DMA and WDT.
The XCZU4EV-1FBVB900E is supplied in a 900-FCBGA (31x31) package and operates within a temperature range of 0°C to 100°C (TJ). Its architecture combines MCU and FPGA capabilities, making it suitable for demanding applications.
This component is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 1. It is designed for applications in aerospace, defense, automotive, and industrial automation.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XCZU4EV-1FBVB900E features a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2.
The XCZU4EV-1FBVB900E has a RAM size of 256 KB.
The operating temperature range for the XCZU4EV-1FBVB900E is 0°C to 100°C (TJ).
The XCZU4EV-1FBVB900E is supplied in a 900-FCBGA (31x31) package.
The XCZU4EV-1FBVB900E is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the XCZU4EV-1FBVB900E is 1.