| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
402 pcs
|
402 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
The XC6SLX150-2FGG900C from Advanced Micro Devices is a Field Programmable Gate Array (FPGA) designed for embedded applications. This device features a substantial 147,443 logic elements and 11,519 LABs, supported by 4,939,776 total RAM bits.
It offers 576 I/O pins and operates at a voltage range of 1.14V to 1.26V. The operating temperature is specified from 0°C to 85°C (TJ). The component is housed in a 900-FBGA package, with a supplier device package designation of 900-FBGA (31x31), and utilizes surface mount technology.
This FPGA is suitable for various digital logic and processing tasks where reconfigurability is a key requirement. Its specifications make it a robust choice for complex embedded systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC6SLX150-2FGG900C has 147,443 logic elements.
The operating voltage is between 1.14V and 1.26V.
The operating temperature range is 0°C to 85°C (TJ).
It is in a 900-BBGA package, with the supplier device package being 900-FBGA (31x31).
The mounting type is Surface Mount.