| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,205 pcs
|
1205 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
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| Number of Gates | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| SVHC Present | |
| Supplier Device Package | |
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| Total RAM Bits | |
| Voltage |
This FPGA from Advanced Micro Devices, part number XC3SD3400A-5FGG676C, is designed for embedded applications. It features 53,712 logic elements and 5,968 LABs, with a total of 3,400,000 gates. The device supports 469 I/O pins and has a total RAM bit count of 2,322,432.
Operating within a temperature range of 0°C to 85°C (TJ), this FPGA requires a voltage of 1.14V to 1.26V. It is available in a 676-FBGA (27x27) package and utilizes surface mount technology.
Key electrical characteristics include a substantial number of logic elements and I/O pins, making it suitable for complex digital processing tasks. The device's operating voltage and temperature range are important considerations for system design and reliability.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is 0°C to 85°C (TJ).
The operating voltage is 1.14V to 1.26V.
It has 469 I/O pins.
The total RAM bits are 2,322,432.
There are 53,712 logic elements.
It is a 676-FBGA (27x27) package designed for surface mounting.