| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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2,000 pcs
|
2000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This Advanced Micro Devices XC3SD3400A-4FGG676I is a Field Programmable Gate Array (FPGA) designed for embedded applications. It features 53,712 logic elements and 3,400,000 gates, with a total of 2,322,432 RAM bits. The device offers 469 I/O pins and operates at a voltage range of 1.14V to 1.26V.
The operating temperature for this FPGA is specified as -40°C to 100°C (TJ). It is packaged in a 676-FBGA (27x27) format and utilizes surface mount technology. The part number is XC3SD3400A-4FGG676I, with a distributor part number of XC3SD3400A-4FGG676I-ND.
Compliance information indicates RoHS3 compliance, MSL 1, and REACH unaffected status. However, these compliance details are unverified and should be treated with low confidence.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC3SD3400A-4FGG676I has 53,712 logic elements.
The XC3SD3400A-4FGG676I offers 469 I/O pins.
The operating voltage range for the XC3SD3400A-4FGG676I is 1.14V to 1.26V.
The operating temperature for the XC3SD3400A-4FGG676I is -40°C to 100°C (TJ).
The XC3SD3400A-4FGG676I is supplied in a 676-FBGA (27x27) package.
The mounting type for the XC3SD3400A-4FGG676I is Surface Mount.