| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
723 pcs
|
723 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type | |
| Number of Gates | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Supplier Package | |
| Total RAM Bits | |
| Voltage |
The Advanced Micro Devices XC3S5000-4FGG676C is a Field Programmable Gate Array (FPGA) designed for embedded applications. This device features 74880 logic elements and 8320 LABs, providing significant processing power.
It offers 489 I/O pins, enabling extensive connectivity. The FPGA operates within a voltage range of 1.14V to 1.26V and has a total RAM bit count of 1,916,928. The operating temperature range is 0°C to 85°C (TJ).
This component is supplied in a 676-FBGA (27x27) package, designed for surface mounting. The 676-BGA package ensures a compact footprint for integration into various electronic designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC3S5000-4FGG676C has 74880 logic elements.
The XC3S5000-4FGG676C offers 489 I/O pins.
The operating voltage range is 1.14V to 1.26V.
The package type is 676-FBGA (27x27).
The operating temperature is 0°C to 85°C (TJ).