| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,013 pcs
|
3013 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type | |
| Number of Gates | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Supplier Package | |
| Total RAM Bits | |
| Voltage |
The XC3S2000-4FG676C is a Field Programmable Gate Array (FPGA) from Advanced Micro Devices. This component features 46080 logic elements and 5120 LABs, with a total of 2,000,000 gates. It offers 489 I/O pins and 737,280 total RAM bits.
The device operates within a temperature range of 0°C to 85°C (TJ) and requires an operating voltage between 1.14V and 1.26V. It is designed for surface mount applications and comes in a 676-FBGA (27x27) package.
This FPGA is suitable for various embedded applications requiring programmable logic density and performance. Its specifications make it a candidate for complex digital designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is 0°C to 85°C (TJ).
The device is in a 676-BGA package, specifically a 676-FBGA (27x27) from the supplier.
The operating voltage is between 1.14V and 1.26V.
It has 489 I/O pins.
The FPGA contains 46080 logic elements.
The total RAM bits available are 737280.