| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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5,669 pcs
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5669 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Advanced Micro Devices XC2S200-6FG256C is a Field Programmable Gate Array (FPGA) designed for various electronic applications. This component features 5292 logic elements and 1176 logic array blocks, providing significant processing capabilities.
With a total of 57344 RAM bits and an equivalent gate count of 200000, the XC2S200-6FG256C offers substantial resources for complex digital designs. It supports 176 I/O pins, allowing for extensive interfacing with other system components.
The operating voltage for this FPGA ranges from 2.375V to 2.625V, and it is designed to operate reliably within a temperature range of 0°C to 85°C (TJ). The device is available in a 256-BGA package, specifically a 256-FBGA (17x17) size, and utilizes surface mount technology for integration into printed circuit boards.
This FPGA is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating its suitability for a wide range of manufacturing environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC2S200-6FG256C FPGA has 5292 logic elements.
The XC2S200-6FG256C FPGA has 176 I/O pins.
The operating voltage range for the XC2S200-6FG256C FPGA is 2.375V to 2.625V.
The XC2S200-6FG256C FPGA is supplied in a 256-BGA package, specifically a 256-FBGA (17x17) size.
The operating temperature for the XC2S200-6FG256C FPGA is 0°C to 85°C (TJ).
