TMPA8873PSBNG
Toshiba
The Toshiba TMPA8873PSBNG is an integrated circuit in a DIP-64 package. It is RoHS3 Compliant and has an MSL rating of 1.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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2,440 pcs
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2440 pcs | On Request | 1 | On Request | On Request | 2007 | On Request | On Request |
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| SVHC Present |
The TSUM16AR-LF from MSTAR is a Multimedia Integrated Circuit (IC) designed for various applications. This component comes in a DIP-64 package, making it suitable for through-hole mounting.
Key specifications include RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for standard handling and assembly processes. The REACH status is listed as unaffected.
This IC is manufactured by MStar Semiconductor and is available through Jotrin Electronics. The product details suggest it is part of the broader category of Specialized ICs within Power Management ICs.
Further technical details, such as operating voltage and temperature, are not explicitly provided in the available data but would typically be found in a detailed datasheet. The DIP-64 package requires specific board space and soldering considerations during integration.
The MSTAR TSUM16AR-LF comes in a DIP-64 package.
The TSUM16AR-LF is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the TSUM16AR-LF is 1 Unlimited.
The REACH status for the TSUM16AR-LF is Unaffected.