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TMPA8873PSBNG The Toshiba TMPA8873PSBNG is an integrated circuit in a DIP-64 package. It is RoHS3 Compliant and has an MSL rating of 1.
Mfr Part #:

TMPA8873PSBNG

Available from 1 distributors
Mfr Name: Toshiba
Toshiba
The Toshiba TMPA8873PSBNG is an integrated circuit in a DIP-64 package. It is RoHS3 Compliant and has an MSL rating of 1.
✓ Total Stock: 275 pcs

TMPA8873PSBNG Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Optech Co.,Limited ✓
Non-Authorised Inventory information
275 pcs
On Request
275 pcs On Request 1 On Request On Request 0810+ On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

TMPA8873PSBNG Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Package / Case
SVHC Present
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TMPA8873PSBNG Description

Short technical summary and product information.

The TMPA8873PSBNG from Toshiba is an integrated circuit housed in a DIP-64 package. This component is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for general purpose applications.

 

The packaging details specify a DIP-64 case. The part is described as new and original, with a stated stock quantity available. Shipping is available from Hong Kong via DHL/Fedex/TNT/UPS.

 

This integrated circuit is suitable for various electronic designs requiring a DIP-64 package. Its compliance with RoHS3 standards makes it a consideration for environmentally conscious projects.

TMPA8873PSBNG Quick Information

Product Type: Integrated Circuit
Canonical Name: TMPA8873PSBNG
Subcategory: General Purpose Integrated Circuits

TMPA8873PSBNG Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

TMPA8873PSBNG Features

  • RoHS3 compliant integrated circuit in DIP-64 package.
  • MSL 1 unlimited moisture sensitivity level rating.
  • REACH unaffected environmental compliance status.
  • DIP-64 package for through-hole mounting applications.
  • Manufactured by Toshiba as part number TMPA8873PSBNG.

TMPA8873PSBNG Applications

  • General purpose integrated circuit
  • Suitable for DIP package designs

TMPA8873PSBNG FAQs

3 frequently asked questions generated from this part’s specifications.
What is the RoHS status of the TMPA8873PSBNG?

The TMPA8873PSBNG is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for TMPA8873PSBNG?

The MSL for TMPA8873PSBNG is Level 1.

What is the package type for the TMPA8873PSBNG?

The package type is DIP-64.

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The MSTAR TSUM16AR-LF is a Multimedia IC packaged in a DIP-64 format. It is RoHS3 Compliant and has an MSL rating of 1.
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