| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
4,000 pcs
|
4000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| SVHC Present | |
| Supplier Device Package |
The Kioxia America, Inc. THGBMFG6C1LBAIL is an eMMC Flash Memory IC with a substantial 64GB capacity. This component is designed for surface mounting, utilizing a 153-FBGA (11.5x13mm) package.
As a memory integrated circuit, the THGBMFG6C1LBAIL is suitable for various data storage applications within electronic devices. Its eMMC interface provides a standardized way to integrate flash storage. The surface mount design facilitates automated assembly processes.
This part is listed with a ROHS3 Compliant status and a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating it requires standard handling procedures. The REACH status is noted as REACH Unaffected.
Further technical specifications, such as operating voltage, operating temperature, and specific interface details, would typically be found in the manufacturer's datasheet. The component is identified by its manufacturer part number THGBMFG6C1LBAIL and also carries the distributor part number THGBMFG6C1LBAIL-ND.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The THGBMFG6C1LBAIL memory IC has a capacity of 64GB.
The THGBMFG6C1LBAIL is supplied in a 153-FBGA (11.5x13) package.
The THGBMFG6C1LBAIL is designed for Surface Mount.
The THGBMFG6C1LBAIL is ROHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the THGBMFG6C1LBAIL is 1 Unlimited.
The REACH status for the THGBMFG6C1LBAIL is REACH Unaffected.