| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,500 pcs
|
2500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Style | |
| Mounting Type | |
| SVHC Present | |
| Supplier Device Package |
The Kioxia America, Inc. THGBMFG7C1LBAIL is a high-density flash memory integrated circuit designed for various storage applications. This component is specified with a 153-FBGA (11.5x13) package, indicating a compact footprint suitable for modern electronic designs.
It features a surface mount type, facilitating automated assembly processes. The device is compliant with RoHS3 standards, ensuring it meets environmental regulations for hazardous substances. Additionally, it has a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under standard conditions and requires no special handling regarding moisture absorption.
This flash memory IC is suitable for applications requiring reliable and efficient data storage. Its specifications make it a viable option for embedded systems, consumer electronics, and other devices where space and environmental compliance are critical factors.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The THGBMFG7C1LBAIL is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.
The mounting type is Surface Mount.
The package is 153-FBGA (11.5x13).