PUMD10,115
NXP Semiconductors
The NXP Semiconductors PUMD10,115 is a pre-biased bipolar transistor array featuring 1 NPN and 1 PNP transistor. It operates at up to 50V and 100mA.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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63 pcs
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63 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The Texas Instruments SNJ54LS279AJ is a quadruple RS latch designed for high-speed applications. It belongs to the LS technology family and features bipolar inputs with push-pull outputs.
This latch offers 4 basic S-R flip-flop latches in a single package. Under conventional operation, the S-R inputs are normally held high. Pulsing the S input low sets the Q output high, while pulsing the R input low resets the Q output low. It is important to note that the S-R inputs should not be taken low simultaneously, as this can lead to unpredictable Q output behavior.
Key electrical specifications include a maximum data rate of 70 Mbps, a maximum IOL of 4 mA, and a maximum IOH of -0.4 mA. The device is rated for military applications and operates across a wide temperature range of -55 to 125°C.
Available in various package options including CDIP, LCCC, and CFP, the SNJ54LS279AJ is suitable for demanding environments. Package options include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.27 | $10.27 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The SNJ54LS279AJ is a quadruple RS latch.
The SNJ54LS279AJ has 4 channels.
The maximum data rate for the SNJ54LS279AJ is 70 Mbps.
The operating temperature range is -55 to 125°C.
Available package options include CDIP (J) 16, LCCC (FK) 20, and CFP (W) 16, as well as Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs.
