AS4C64M16D3LW-10BCN
Alliance
The Alliance AS4C64M16D3LW-10BCN is a memory component. It features RoHS3 Compliance and an MSL of 1 Unlimited.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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5,166 pcs
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5166 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| SVHC Present |
The K4B4G1646B-HCKO from Samsung Electronics is a memory integrated circuit designed for various electronic applications. This component is housed in a Ball Grid Array (BGA) package, suitable for surface-mount designs.
Key specifications include its RoHS3 compliance, indicating adherence to environmental standards for hazardous substances. It also features a Moisture Sensitivity Level (MSL) of 1, signifying unlimited shelf life under recommended storage conditions. The REACH status is noted as unaffected.
This memory IC is manufactured by Samsung Electronics, a recognized leader in semiconductor technology. Its BGA packaging facilitates compact board layouts and efficient thermal management in electronic devices. The part number K4B4G1646B-HCKO identifies this specific memory component within Samsung's product portfolio.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The K4B4G1646B-HCKO is RoHS3 Compliant.
The MSL for the K4B4G1646B-HCKO is Level 1.
The REACH status is Unaffected.
This component uses a BGA package.
