| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,094 pcs
|
2094 pcs | On Request | 1 | On Request | On Request | 1928+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Halogen Free | |
| Lead Spacing | |
| Memory Organization | |
| Memory Size | |
| Mounting Type | |
| Operating Temperature | |
| Voltage |
The DOSILICON FMN1SD5SBB-50IA is a Stacked Multi-Chip Product (MCP) designed for low-power applications. It integrates 1Gb of NAND Flash memory with x16 organization and 512Mb of LPDDR1 DRAM with x16 organization.
This MCP operates with a core/IO power supply voltage of 1.7V to 1.95V, centered around 1.8V, making it suitable for mobile internet and IoT devices requiring low power consumption. The LPDDR1 DRAM component operates at a speed of 200MHz.
The device is housed in a 130-ball FBGA package with dimensions of 8.0x9.0mm and a ball pitch of 0.65mm. It is designed for surface mount applications and is lead and halogen-free. The operating temperature range for industrial parts is -40°C to 85°C.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.17 | $1.17 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The NAND Flash density is 1Gb with an organization of x16.
The DRAM density is 512Mb with an organization of x16.
The DRAM type is LPDDR1 and its speed is 200MHz.
The MCP operates at a supply voltage of 1.8V, with core/IO power ranging from 1.7V to 1.95V.
The operating temperature range for industrial parts is -40°C to 85°C.
The FMN1SD5SBB-50IA is supplied in a 130-ball FBGA package measuring 8.0x9.0mm with a 0.65mm ball pitch.