| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
4 pcs
|
4 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name |
The COMX-CORE-HTSNK from Artesyn Embedded Power is a heat sink component designed for effective thermal management in electronic systems. This part is categorized under Heat Sinks within the broader Thermal Management product group.
Key compliance attributes include RoHS3 compliance, indicating adherence to restrictions on hazardous substances. It also carries a Moisture Sensitivity Level (MSL) of 1 Unlimited, signifying it is not sensitive to moisture and can be handled without special precautions. The REACH status is marked as Unaffected.
While specific material, dimensions, and thermal resistance data are not detailed here, the COMX-CORE-HTSNK is intended for applications requiring efficient heat dissipation. Its design and compliance features make it suitable for integration into various electronic assemblies where maintaining optimal operating temperatures is critical.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.00 | $2.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The COMX-CORE-HTSNK is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.