| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
20,000 pcs
|
20000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Access Time | |
| Clock Frequency | |
| Halogen Free | |
| Lead Style | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Mounting Type | |
| Operating Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Technology | |
| Voltage Supply |
The Alliance AS4C32M16D2C-25BCNTR is a high-performance DRAM memory integrated circuit. It utilizes SDRAM - DDR3L technology, providing a substantial memory size of 8 Gbit with a memory organization of 512M x 16. This component features a parallel memory interface and operates at a clock frequency of 933 MHz, ensuring efficient data transfer.
With an access time of 20 ns and a write cycle time of 15 ns, this memory IC is designed for speed-critical applications. It requires a supply voltage ranging from 1.283V to 1.45V and operates within a temperature range of -40°C to 95°C.
The AS4C32M16D2C-25BCNTR is designed for surface mounting and comes in a 96-TFBGA package, specifically a 96-FBGA (9x13) supplier device package. It is supplied in tape and reel packaging, suitable for automated assembly processes.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
1.283V to 1.45V.
96-TFBGA (96-FBGA 9x13 mm).
-40°C to 95°C (TC).
8 Gbit.
933 MHz.
512M x 16.
Parallel.