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75S10020B200BR9001 75S10020B200BR9001 is a CPLD from Broadcom Limited in a 784 FCBGA+HS package measuring 29x29mm.
Mfr Part #:

75S10020B200BR9001

Available from 1 distributors
Mfr Name: Broadcom Limited
Broadcom Limited
75S10020B200BR9001 is a CPLD from Broadcom Limited in a 784 FCBGA+HS package measuring 29x29mm.
✓ Total Stock: 584 pcs

75S10020B200BR9001 Available from 1 distributor

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✓ Non-Authorised
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Rayichip ✓
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584 pcs
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584 pcs On Request 1 On Request On Request On Request On Request On Request
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75S10020B200BR9001 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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Manufacturer Name
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Termination Style
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75S10020B200BR9001 Description

Short technical summary and product information.

The 75S10020B200BR9001 is a Complex Programmable Logic Device (CPLD) manufactured by Broadcom Limited. It is housed in a 784-ball FCBGA+HS (Flip Chip Ball Grid Array with Heat Spreader) package with a body size of 29x29 mm. The component is designed for surface mount assembly and uses ball termination style.

 

This CPLD is suitable for a wide range of embedded logic applications including industrial equipment, communication devices, automotive electronics, and control boards. The 784-ball array provides ample I/O connectivity for complex logic integration.

 

The device is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 1 (unlimited floor life), simplifying handling and storage requirements. It is also REACH unaffected.

75S10020B200BR9001 Quick Information

Product Type: CPLD (Complex Programmable Logic Device)
Canonical Name: 75S10020B200BR9001 CPLD, 784 FCBGA+HS, 29x29mm
Subcategory: Complex Programmable Logic Devices

75S10020B200BR9001 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

75S10020B200BR9001 Features

  • 784-ball FCBGA+HS package with heat spreader.
  • 29x29 mm body size for compact designs.
  • Surface mount assembly with ball termination.
  • RoHS3 compliant and REACH unaffected.
  • MSL 1 unlimited floor life rating.

75S10020B200BR9001 Applications

  • Industrial equipment control and automation.
  • Automotive electronic control modules.
  • Communication device logic integration.
  • Embedded system prototyping and production.
  • Power system management and control boards.

75S10020B200BR9001 FAQs

5 frequently asked questions generated from this part’s specifications.
What is the package type of 75S10020B200BR9001?

The package is 784 FCBGA+HS (Flip Chip Ball Grid Array with Heat Spreader).

What is the body size of this CPLD?

The package body size is 29x29 mm.

Is 75S10020B200BR9001 RoHS compliant?

Yes, it is RoHS3 compliant.

What is the Moisture Sensitivity Level (MSL) of this part?

The MSL rating is 1 (unlimited floor life).

Is 75S10020B200BR9001 REACH compliant?

Yes, it is REACH unaffected.

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