| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
840 pcs
|
840 pcs | On Request | 1 | On Request | On Request | 22+ | On Request | On Request |
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| Manufacturer Name | |
| Mounting Type | |
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| Number of LABs | |
| Number of Logic Elements | |
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| Total RAM Bits | |
| Voltage |
The Intel 5AGXMA7G4F31C4N is a high-density FPGA featuring 242000 logic elements, 384 I/O pins, and 15470592 bits of embedded RAM. It operates from a supply voltage of 1.07V to 1.13V and is designed for surface mount assembly in a 896-BBGA/FCBGA package, with a supplier device package of 896-FBGA (31x31). The device supports an operating temperature range of 0°C to 85°C (TJ).
With 11460 LABs (Logic Array Blocks), this FPGA provides ample resources for complex digital logic designs. The 384 I/O pins enable flexible interfacing with peripherals and system buses. The device is RoHS3 compliant, has an MSL of 1 (Unlimited), and is REACH unaffected, though these compliance values are unverified.
The 896-FBGA package offers a compact footprint suitable for space-constrained applications. The surface mount mounting type facilitates automated assembly processes. This FPGA is intended for use in embedded systems requiring high logic capacity and moderate I/O counts.
242000 logic elements.
384 I/O.
1.07V to 1.13V.
896-BBGA, FCBGA; supplier device package is 896-FBGA (31x31).
0°C to 85°C (TJ).
15470592 bits.
11460.