| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,145 pcs
|
1145 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Total RAM Bits | |
| Voltage |
The Intel 5AGXMA3D4F27I3G is a Field Programmable Gate Array (FPGA) designed for high-performance logic applications. It features 156,000 logic elements (LEs) organized into 7,362 Logic Array Blocks (LABs), along with 11,746,304 bits of embedded RAM. The device provides 336 user I/O pins for flexible connectivity.
Operating from a core supply voltage of 1.12V to 1.18V, the FPGA is rated for junction temperatures from -40°C to 100°C, making it suitable for industrial and extended temperature environments. The device is mounted using surface mount technology and is housed in a 672-FBGA (27x27) package, which is also compatible with 672-BBGA and FCBGA footprints.
This FPGA is ideal for embedded systems requiring high logic density, digital signal processing, and communication interfaces. Its combination of logic resources, I/O count, and embedded memory supports a wide range of design implementations without the need for external memory in many cases.
The FPGA has 156,000 logic elements.
It has 336 I/O pins.
The core supply voltage ranges from 1.12V to 1.18V.
It is supplied in a 672-FBGA (27x27) surface mount package, also compatible with 672-BBGA and FCBGA.
The FPGA includes 11,746,304 bits (11.75 Mbit) of embedded RAM.
The junction temperature range is -40°C to 100°C.
The device is surface mount.