What are Solder ?
Solder is a fusible metal alloy used to join electronic components together by melting and solidifying. It is commonly used in applications such as production electronics assembly and maintenance for reliable connections. Important specifications for selection include Composition, which affects conductivity and melting behavior; Melting Point, which determines the soldering temperature; and Flux Type, which influences the solder's ability to flow and adhere to surfaces. Ensuring these specifications align with design requirements is crucial for effective sourcing and application.
Parts in this category
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| Part & Mfr | Total Stock | Pricing & RFQ | Composition | Diameter | Flux Type | Form | Melting Point | Mesh Type | Process | Shelf Life | Storage | Storage Temperature | Type | Wire Gauge | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Chip Quik Inc.
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Sn60Pb40 (60/40) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 4 oz (113.40g) | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | - | Wire Solder | - | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 4 oz (113.40g) | 361°F (183°C) | - | Leaded | - | - | - | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.022" (0.56mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | - | Solder Sphere | - | |
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Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 0.53 oz (15g), 5cc | 423 ~ 428°F (217 ~ 220°C) | 4 | Lead Free | 12 Months | 68°F ~ 77°F (20°C ~ 25°C) | - | Solder Paste | - | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 0.53 oz (15g), 5cc | 422 ~ 428°F (217 ~ 220°C) | 5 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.020" (0.51mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | - | Solder Sphere | - | |
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Chip Quik Inc.
|
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Sn63Pb37 (63/37) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 4 oz (113.40g) | 361°F (183°C) | - | Leaded | - | - | - | Wire Solder | 24 AWG, 25 SWG | |
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Chip Quik Inc.
|
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Bi57Sn42Ag1 (57/42/1) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 279°F (137°C) | 4 | - | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | - | No-Clean | Syringe, 0.53 oz (15g), 5cc | 361°F (183°C) | 4 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
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Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 2 oz (56.70g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | - | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 2 oz (56.70g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | - | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.016" (0.40mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | - | Solder Sphere | - | |
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Apex Tool Group
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Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.039" (0.99mm) | No-Clean | Spool, 3.53 oz (100g) | - | - | Lead Free | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
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Bi58Sn42 (58/42) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 0.35 oz (10g) | 280°F (138°C) | - | Lead Free | - | - | - | Wire Solder | - | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | Rosin Activated (RA) | Spool, 4 oz (113.40g) | 422 ~ 428°F (217 ~ 220°C) | - | Lead Free | 60 Months | - | - | Wire Solder | 21 AWG, 20 SWG | |
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Chip Quik Inc.
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Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 0.35 oz (10g) | 280°F (138°C) | - | Lead Free | - | - | - | Wire Solder | 18 AWG, 19 SWG | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.014" (0.36mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | No-Clean, Water Soluble | Spool, 0.07 oz (2g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | - | Wire Solder | - | |
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Apex Tool Group
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Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.031" (0.79mm) | No-Clean | Spool, 3.53 oz (100g) | - | - | Lead Free | - | - | - | Wire Solder | - | |
Chip Quik Inc.
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Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 2 oz (56.70g) | 354°F (179°C) | - | Leaded | - | - | - | Wire Solder | - | |
Canfield Technologies
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- | - | - | - | - | - | - | - | - | - | - | - | |
Chip Quik Inc.
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 281°F (138°C) | 3 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
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Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.008" (0.20mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024" (0.61mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
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Chip Quik Inc.
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Sn60Pb40 (60/40) | - | - | Bar, 1 lb (454g) | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | - | Bar Solder | - | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | - | Water Soluble | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 3 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Apex Tool Group
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Sn60Pb40 (60/40) | 0.012" (0.31mm) | No-Clean | Spool, 3.53 oz (100g) | - | - | Leaded | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
|
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 280°F (138°C) | 5 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Chip Quik Inc.
|
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Sn60Pb40 (60/40) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | - | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 361°F (183°C) | - | Leaded | - | - | - | Wire Solder | 20 AWG, 22 SWG | |
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Chip Quik Inc.
|
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Price on request
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Sn63Pb37 (63/37) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 361°F (183°C) | - | Leaded | - | - | - | Wire Solder | 24 AWG, 25 SWG | |
Canfield Technologies
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- | - | - | - | - | - | - | - | - | - | - | - | |
SRA Soldering Products
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Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | 0.020" (0.51mm) | Water Soluble | Spool, 4 oz (113.40g) | - | - | Lead Free | 24 Months | - | - | Wire Solder | - | |
Chip Quik Inc.
|
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Price on request
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 0.53 oz (15g), 5cc | 423 ~ 428°F (217 ~ 220°C) | 5 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.018" (0.46mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
|
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Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | No-Clean, Water Soluble | Spool, 3.53 oz (100g) | 354°F (179°C) | - | Leaded | - | - | - | Wire Solder | 27 AWG, 28 SWG | |
Chip Quik Inc.
|
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Price on request
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016" (0.40mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
|
Chip Quik Inc.
|
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Price on request
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | Water Soluble | Syringe, 1.23 oz (35g), 10cc | 423 ~ 428°F (217 ~ 220°C) | 3 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Chip Quik Inc.
|
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Price on request
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014" (0.36mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | - | Water Soluble | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 4 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
Chip Quik Inc.
|
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Sn60Pb40 (60/40) | 0.015" (0.38mm) | No-Clean | Spool, 4 oz (113.40g) | 361°F ~ 370°F (183°C ~ 188°C) | - | Leaded | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
|
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Bi58Sn42 (58/42) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 0.7 oz (20g) | 280°F (138°C) | - | Lead Free | - | - | - | Wire Solder | - | |
MG Chemicals
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Bi57Sn42Ag1 (57/42/1) | - | No-Clean | Syringe, 0.88 oz (25g) | 281°F (138°C) | - | Lead Free | 24 Months (Refrigerated), 12 Months (Room Temp) | 35°F ~ 50°F (2°C ~ 10°C) | - | Solder Paste | - | |
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Chip Quik Inc.
|
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 281°F (138°C) | 4 | Lead Free | 12 Months | 68°F ~ 77°F (20°C ~ 25°C) | - | Solder Paste | - | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | - | Solder Sphere | - | |
Apex Tool Group
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean | Spool, 3.53 oz (100g) | - | - | Lead Free | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
|
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Price on request
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 423 ~ 428°F (217 ~ 220°C) | 4 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | - | Solder Paste | - | |
Kester
|
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | No-Clean | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | - | Wire Solder | 20 AWG, 22 SWG |
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