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| Part & Mfr | Total Stock | Pricing & RFQ | Composition | Diameter | Flux Type | Form | Melting Point | Mesh Type | Process | Shelf Life | Storage | Type | Wire Gauge | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | - | Water Soluble | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 5 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
SRA Soldering Products
|
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Sn60Pb40 (60/40) | - | - | Bar, 1 lb (454g) | 361 ~ 370°F (183 ~ 188°C) | - | - | - | - | Bar Solder | - | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | - | Jar | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | 24 Months | - | Solder Sphere | - | |
|
SRA Soldering Products
|
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Bi57Sn42Ag1 (57/42/1) | - | - | Bar, 0.5 lb (227g) | - | - | Lead Free | - | - | Bar Solder | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 4 oz (113.40g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 4 oz (113.40g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 24 AWG, 25 SWG | |
|
Apex Tool Group
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | No-Clean | Spool, 3.53 oz (100g) | - | - | Lead Free | - | - | Wire Solder | - | |
|
Chip Quik Inc.
|
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Bi58Sn42 (58/42) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 0.7 oz (20g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | Bar, 0.5 lb (227g) | 423 ~ 428°F (217 ~ 220°C) | - | Leaded | - | - | Bar Solder | - | |
|
Chip Quik Inc.
|
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Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 0.7 oz (20g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | 18 AWG, 19 SWG | |
MG Chemicals
|
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Sn99.3Cu0.7 (99.3/0.7) | 0.032" (0.81mm) | No-Clean | Spool, 4 oz (113.40g) | 442°F (227°C) | - | Lead Free | 60 Months | 65°F ~ 80°F (18°C ~ 27°C) | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
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Sn63Pb37 (63/37) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 3 | Leaded | 24 Months | 35°F ~ 50°F (2°C ~ 10°C) | Solder Paste | - | |
|
Chip Quik Inc.
|
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Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020" (0.51mm) | No-Clean | Spool, 1 lb (454 g) | 565 ~ 574°F (296 ~ 301°C) | - | Leaded | - | - | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
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Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 441°F (227°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
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Sn60Pb40 (60/40) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 1 oz (28.35g) | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | Wire Solder | - | |
|
Chip Quik Inc.
|
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Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 441°F (227°C) | - | Lead Free | - | - | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 423 ~ 428°F (217 ~ 220°C) | 5 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
Chip Quik Inc.
|
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Sn60Pb40 (60/40) | 0.015" (0.38mm) | No-Clean | Spool, 8 oz (226.80g) | 361°F ~ 370°F (183°C ~ 188°C) | - | Leaded | - | - | Wire Solder | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | No-Clean, Water Soluble | Spool, 0.35 oz (10g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | - | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | - | - | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 21 AWG, 20 SWG | |
|
Chip Quik Inc.
|
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | Water Soluble | Syringe, 1.23 oz (34.869g) | 280°F (138°C) | 4 | - | 12 Months | 37°F ~ 77°F (3°C ~ 25°C) | Solder Paste | - | |
Chip Quik Inc.
|
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Sn63Pb37 (63/37) | - | Water Soluble | Jar, 8.8 oz (250g) | 361°F (183°C) | 3 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
Chip Quik Inc.
|
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In52Sn48 (52/48) | - | - | Spool | 244°F (118°C) | - | Lead Free | - | - | Ribbon Solder | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 1.23 oz (34.869g) | 423°F (217°C) | 3 | - | 12 Months | 37°F ~ 77°F (3°C ~ 25°C) | Solder Paste | - | |
|
KESTER
|
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Sn63Pb37 (63/37) | - | Water Soluble | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 3 | Leaded | 6 Months | 32°F ~ 50°F (0°C ~ 10°C) | Solder Paste | - | |
Chip Quik Inc.
|
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Sn99.3Cu0.7 (99.3/0.7) | - | - | Bar, 1 lb (454g) | 441°F (227°C) | - | Lead Free | - | - | Bar Solder | - | |
|
SRA Soldering Products
|
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Sn63Pb37 (63/37) | 0.032" (0.81mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | - | - | Wire Solder | 20 AWG, 21 SWG | |
Chip Quik Inc.
|
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Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 354°F (179°C) | - | Leaded | - | - | Wire Solder | 20 AWG, 22 SWG | |
KESTER
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 423 ~ 424°F (217 ~ 218°C) | 3 | Lead Free | 6 Months | 32°F ~ 50°F (0°C ~ 10°C) | Solder Paste | - | |
|
Chip Quik Inc.
|
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Sn62Pb36Ag2 (62/36/2) | - | - | Bar, 1 lb (454g) | 354°F (179°C) | - | Leaded | - | - | Bar Solder | - | |
KESTER
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Sn60Pb40 (60/40) | 0.093" (2.36mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361 ~ 374°F (183 ~ 190°C) | - | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 11 AWG, 13 SWG | |
MG Chemicals
|
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Sn60Pb40 (60/40) | 0.062" (1.57mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 14 AWG, 16 SWG | |
|
MG Chemicals
|
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Sn60Pb40 (60/40) | 0.032" (0.81mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
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Sn60Pb40 (60/40) | 0.025" (0.64mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 22 AWG, 23 SWG | |
MG Chemicals
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Sn60Pb40 (60/40) | 0.050" (1.27mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 16 AWG, 18 SWG | |
|
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.032" (0.81mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.040" (1.02mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 18 AWG, 19 SWG | |
MG Chemicals
|
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Sn60Pb40 (60/40) | 0.040" (1.02mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 18 AWG, 19 SWG | |
|
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.025" (0.64mm) | Rosin Activated (RA) | Spool, 8 oz (227g), 1/2 lb | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 22 AWG, 23 SWG | |
Chip Quik Inc.
|
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Bi57Sn42Ag1 (57/42/1) | - | - | Bar, 1 lb (454g) | 280°F (138°C) | - | Lead Free | - | - | Bar Solder | - | |
Apex Tool Group
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean | Spool, 8.8 oz (250g) | - | - | Lead Free | - | - | Wire Solder | - | |
KESTER
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Sn63Pb37 (63/37) | 0.020" (0.51mm) | No-Clean | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 36 Months | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
|
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Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | No-Clean | Spool, 1 lb (454 g) | 441°F (227°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
|
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Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | No-Clean | Spool, 4 oz (113.40g) | 423 ~ 430°F (217 ~ 221°C) | - | Lead Free | 60 Months | 65°F ~ 80°F (18°C ~ 27°C) | Wire Solder | 20 AWG, 21 SWG | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | Water Soluble | Jar, 8.8 oz (250g) | 423 ~ 428°F (217 ~ 220°C) | 3 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
|
KESTER
|
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Sn63Pb37 (63/37) | 0.025" (0.64mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 22 AWG, 23 SWG | |
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | No-Clean, Water Soluble | Spool, 8 oz (227g), 1/2 lb | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 27 AWG, 28 SWG | |
|
Chip Quik Inc.
|
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Sn60Pb40 (60/40) | 0.015" (0.38mm) | No-Clean | Spool, 1 lb (453.592g) | 361°F ~ 370°F (183°C ~ 188°C) | - | Leaded | - | - | Wire Solder | - | |
KESTER
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | No-Clean | Spool, 17.64 oz (500g) | 423 ~ 424°F (217 ~ 218°C) | - | Lead Free | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 24 AWG, 25 SWG | |
|
Chip Quik Inc.
|
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Sn99.3Cu0.7 (99.3/0.7) | - | - | Bar, 1 lb (454g) | 441°F (227°C) | - | Leaded | - | - | Bar Solder | - | |
Harimatec Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.022" (0.56mm) | No-Clean | Spool, 8.8 oz (250g) | 423°F (217°C) | - | Lead Free | - | 59°F ~ 86°F (15°C ~ 30°C) | Wire Solder | 23 AWG, 24 SWG | |
|
KESTER
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Sn60Pb40 (60/40) | 0.020" (0.51mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361 ~ 374°F (183 ~ 190°C) | - | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 24 AWG, 25 SWG | |
|
KESTER
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Sn63Pb37 (63/37) | 0.062" (1.57mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 14 AWG, 16 SWG | |
KESTER
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Sn63Pb37 (63/37) | 0.025" (0.64mm) | Rosin Mildly Activated (RMA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 36 Months | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 22 AWG, 23 SWG | |
KESTER
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Sn63Pb37 (63/37) | 0.031" (0.79mm) | Water Soluble | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 36 Months | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 20 AWG, 22 SWG | |
Chip Quik Inc.
|
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Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | No-Clean | Spool, 1 lb (454 g) | 441°F (227°C) | - | Lead Free | - | - | Wire Solder | 24 AWG, 25 SWG | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | Bar, 1 lb (454g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Bar Solder | - | |
|
MG Chemicals
|
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Sn60Pb40 (60/40) | 0.032" (0.81mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361 ~ 376°F (183 ~ 191°C) | - | Leaded | 60 Months | - | Wire Solder | 20 AWG, 21 SWG | |
Chip Quik Inc.
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In100 (100) | - | - | Spool | 315°F (157°C) | - | Lead Free | - | - | Ribbon Solder | - | |
|
Chip Quik Inc.
|
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | - | Spool, 8 oz (227g), 1/2 lb | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | - | |
|
Harimatec Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | No-Clean | Spool, 8.8 oz (250g) | 423°F (217°C) | - | Lead Free | - | - | Wire Solder | 27 AWG, 28 SWG | |
|
Chip Quik Inc.
|
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Bi58Sn42 (58/42) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 1.8 oz (50g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | - | |
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.040" (1.02mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 18 AWG, 19 SWG | |
|
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.032" (0.81mm) | No-Clean | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.032" (0.81mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 20 AWG, 21 SWG | |
MG Chemicals
|
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Sn63Pb37 (63/37) | 0.025" (0.64mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 361°F (183°C) | - | Leaded | 60 Months | - | Wire Solder | 22 AWG, 23 SWG | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | No-Clean, Water Soluble | Spool, 1.76 oz (50g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 32 AWG, 35 SWG | |
Chip Quik Inc.
|
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Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 1.8 oz (50g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | 18 AWG, 19 SWG | |
Chip Quik Inc.
|
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Jar, 8.8 oz (250g) | 281°F (138°C) | 4 | Lead Free | 12 Months | 68°F ~ 77°F (20°C ~ 25°C) | Solder Paste | - | |
|
Chip Quik Inc.
|
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean | Spool, 1 lb (454 g) | 422 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 21 SWG | |
SRA Soldering Products
|
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Sn96Ag4 (96/4) | 0.045" (1.14mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 430°F (221°C) | - | Lead Free | - | - | Wire Solder | 14 AWG, 16 SWG | |
MG Chemicals
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Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | No-Clean | Spool, 8 oz (227g), 1/2 lb | 423 ~ 430°F (217 ~ 221°C) | - | Lead Free | 60 Months | 65°F ~ 80°F (18°C ~ 27°C) | Wire Solder | 20 AWG, 21 SWG | |
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SRA Soldering Products
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Sn96Ag4 (96/4) | 0.062" (1.57mm) | Rosin Activated (RA) | Spool, 1 lb (453.59g) | 430°F (221°C) | - | Lead Free | - | - | Wire Solder | 14 AWG, 16 SWG | |
Chip Quik Inc.
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Sn63Pb37 (63/37) | 0.018" (0.46mm) | - | Jar | 361°F (183°C) | - | Leaded | 24 Months | - | Solder Sphere | - | |
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Sn99.3Cu0.7 (99.3/0.7) | 0.062" (1.57mm) | No-Clean | Spool, 1 lb (454 g) | 441°F (227°C) | - | Lead Free | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 14 AWG, 16 SWG | |
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Chip Quik Inc.
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Sn63Pb37 (63/37) | - | No-Clean | Cartridge, 17.64 oz (500g) | 361°F (183°C) | 4 | Leaded | 12 Months | 68°F ~ 77°F (20°C ~ 25°C) | Solder Paste | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean, Water Soluble | Spool, 1 lb (454 g) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 22 SWG | |
SRA Soldering Products
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | No-Clean | Spool, 1 lb (454 g) | 430°F (221°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 21 SWG | |
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Chip Quik Inc.
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Sn63Pb37 (63/37) | - | Water Soluble | Jar, 8.8 oz (250g) | 361°F (183°C) | 5 | Leaded | 12 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Jar, 1.76 oz (50g) | 422 ~ 428°F (217 ~ 220°C) | 6 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
Harimatec Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | No-Clean | Spool, 1 lb (454 g) | 423°F (217°C) | - | Lead Free | - | - | Wire Solder | 20 AWG, 21 SWG | |
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Chip Quik Inc.
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | Jar, 17.64 oz (500g) | 423°F (217°C) | 3 | Lead Free | 12 Months | - | Solder Paste | - | |
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | Water Soluble | Spool, 1 lb (454 g) | 423 ~ 424°F (217 ~ 218°C) | - | Lead Free | 36 Months | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 22 AWG, 23 SWG | |
Chip Quik Inc.
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Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | No-Clean, Rosin Activated (RA) | Spool, 3.5 oz (100g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | 18 AWG, 19 SWG | |
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Chip Quik Inc.
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Cartridge, 17.64 oz (500g) | 281°F (138°C) | 3 | Lead Free | 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | Solder Paste | - | |
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.050" (1.27mm) | Rosin Activated (RA) | Spool, 1 lb (454 g) | 423 ~ 424°F (217 ~ 218°C) | - | Lead Free | - | 50°F ~ 104°F (10°C ~ 40°C) | Wire Solder | 16 AWG, 18 SWG | |
Chip Quik Inc.
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | No-Clean | Cartridge, 17.64 oz (500g) | 281°F (138°C) | 4 | Lead Free | 12 Months | 68°F ~ 77°F (20°C ~ 25°C) | Solder Paste | - | |
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Sn63Pb37 (63/37) | - | No-Clean | Jar, 17.64 oz (500g) | 361°F (183°C) | 4 | Leaded | 12 Months | 32°F ~ 50°F (0°C ~ 10°C) | Solder Paste | - | |
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Sn63Pb37 (63/37) | - | No-Clean | Cartridge, 21.16 oz (600g) | 361°F (183°C) | 3 | Leaded | 6 Months | 32°F ~ 50°F (0°C ~ 10°C) | Solder Paste | - | |
SRA Soldering Products
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- | 0.020" (0.51mm) | Rosin Activated (RA) | Spool, 2 oz (56.70g) | - | - | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
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Sn63Pb37 (63/37) | - | - | Bar, 0.5 lb (227g) | 361°F (183°C) | - | Leaded | - | - | Bar Solder | - | |
Chip Quik Inc.
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Sn60Pb40 (60/40) | - | - | Bar, 0.5 lb (227g) | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | Bar Solder | - | |
SRA Soldering Products
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- | 0.031" (0.79mm) | Rosin Activated (RA) | Spool, 4 oz (113.40g) | - | - | - | - | - | Wire Solder | - | |
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Chip Quik Inc.
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | - | Spool, 2 oz (56.70g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | - | |
SRA Soldering Products
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Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | No-Clean | - | - | - | Lead Free | - | - | Wire Solder | 24 AWG, 25 SWG | |
Chip Quik Inc.
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Sn60Pb40 (60/40) | - | - | Bar, 1 lb (454g) | 361 ~ 370°F (183 ~ 188°C) | - | Leaded | - | - | Bar Solder | - | |
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Chip Quik Inc.
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Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | - | Spool, 4 oz (113.40g) | 280°F (138°C) | - | Lead Free | - | - | Wire Solder | - | |
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SRA Soldering Products
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Sn99.3Cu0.7 (99.3/0.7) | - | - | Bar, 1 lb (453.59g) | - | - | Lead Free | - | - | Bar Solder | - | |
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KESTER
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Sn63Pb37 (63/37) | - | No-Clean | Syringe, 1.23 oz (35g), 10cc | 361°F (183°C) | 3 | Leaded | 6 Months | 32°F ~ 50°F (0°C ~ 10°C) | Solder Paste | - |
Showing 201-300 of 1,688 products