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Optical Sensors - Image Sensors, Camera

Optical Sensors - Image Sensors, Camera facilitate the capture and processing of visual information in various applications. Key specifications include Active Pixel Array, Frames per Second, and Operating Temperature. These sensors are essential for industrial sensing and monitoring tasks.

2,157 active parts
33 manufacturers
15 distributors
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What are Optical Sensors - Image Sensors, Camera ?

Optical Sensors - Image Sensors, Camera are devices that convert light into electronic signals for imaging applications. They are commonly used in industrial sensing, monitoring, and product design. Important specifications include Active Pixel Array, which affects image resolution; Frames per Second, which determines motion capture quality; and Operating Temperature, which ensures functionality in various environments. Sourcing teams should validate lifecycle status and consider alternate-source options to mitigate supply risks.

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Part & Mfr Total Stock Pricing & RFQ ADC Resolution Active Array Size Active Image Size Active Imager Size Active Pixel Array Active Pixels Architecture Array Format Aspect Ratio Automatic Controls Automotive Grade Binning CRA Chief Ray Angle Color Color Filter Array Color Sensing Colour Sensing Container Type Data Interface Data Interfaces Data Output Options Die Size Dynamic Range Factory Pack Quantity Failure Rate Features Field of View Frame Rate Frame Rate (Typical @ SVGA, NROT) Frame Rate (Typical @ SVGA, ZROT) Frame Rate (Typical @ SXGA, NROT) Frame Rate (Typical @ SXGA, ZROT) Frame Rate (Typical @ VGA, NROT) Frame Rate (Typical @ VGA, ZROT) Frames per Second Global Shutter High Dynamic Range (HDR) High Quality Bayer Scalar Image Sensor Resolution Image Sensor Type Image Size Input Clock Frequency Input Clock Range Interface Lead Spacing Low-light Sensitivity MSL Temperature Maximum Data Rate Maximum Data Rate Parallel Maximum Image Transfer Rate Maximum Operating Temperature Megapixels Minimum Operating Temperature Mounting Style Mounting Type Number of Outputs Number of frames per second Operating Supply Voltage Operating Temperature Operating Temperature (Minimum/Maximum) Operating Voltage Operating Voltage (Maximum) Operating Voltage (Minimum/Maximum) Operating Voltage (Minimum/Typical/Maximum) Optical Format Output Output Clock Maximum Output Format Output Interface Output Sensitivity Package / Case Package / Case Code Package Code Package Description Package Options Package Type Packaging Method Pb-Free Pixel Size Pixel Type Power Consumption Power Consumption (Typical) Power Dissipation Power Dissipation (Typical @ P 1, 4 LVDS, ZROT) Power Dissipation (Typical @ P 1, P 3, 1 LVDS, NROT) Power Dissipation (Typical @ P 1, P 3, 2 LVDS, NROT) Power Dissipation (Typical @ P 2, ZROT) Power Requirements Active Power Requirements Standby Power Supply Primary Modes Refresh Rate Region of Interest (ROI) Resolution SNRMAX Sensitivity Sensor Size Sensor Type Serial Interface Serial Outputs Shutter Shutter Type Size Options Standard Package Qty Standard Package Quantity Subsampling Modes Supplier Device Package Supplier Package Supply Voltage Supply Voltage (Digital) Supply Voltage (Max) Supply Voltage - Analog Supply Voltage - I/O Supply Voltage HiSPi Supply Voltage HiSPi I/O (HiVCM) Supply Voltage HiSPi I/O (SLVS) Supply Voltage HiSPi PHY Supply Voltage HiSPi/MIPI Supply Voltage I/O/Digital Supply Voltage Pixel Tape & Reel Target Temperature Technology Temperature Sensor Type VCM AF Driver Video Mode Voltage Voltage Supply Window Size responsivity
NOIV1SE012KA-GTI
NOIV1SE012KA-GTI
On Semiconductor
4
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 4 - -
Price on request
4
Distributor Stock MOQ Country
Flip Electronics 4 - -
- - - - 4096H x 3072V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 110 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 85°C (TJ) - - - - - - - - - - - - - - - - - - - 4.5µm x 4.5µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 355-µPGA - - - - - - - - - - - - - - - - - CMOS - - 1.6V ~ 2V, 3V ~ 3.6V - - -
CMV20000-1E5C1PA
CMV20000-1E5C1PA
Osram
4
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 4 - -
Price on request
4
Distributor Stock MOQ Country
Flip Electronics 4 - -
- - - - 5120 x 3840 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 30 fps - - - - - - - - - - - - - - - - - - - - - - - -30°C ~ 70°C - - - - - - - - - - - - - - - - - - - 6.4µm x 6.4µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 143-PGA - - - - - - - - - - - - - No - - - CMOS - - 1.8V, 3.3V - - -
NOIX2SE9400B-LTI1
NOIX2SE9400B-LTI1
On Semiconductor
4
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 4 - -
Price on request
4
Distributor Stock MOQ Country
Flip Electronics 4 - -
- - - - 3072H x 3072V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 90 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 85°C (TJ) - - - - - - - - - - - - - - - - - - - 3.2µm x 3.2µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 163-CLGA (20.88x19.9) - - - - - - - - - - - - - - - - - CMOS - - 1.7V ~ 1.9V, 2.7V ~ 2.9V - - -
MT9F002I12-N4000
MT9F002I12-N4000
On Semiconductor
3
From Components Technology Group, Inc.
Distributor Stock MOQ Country
Components Technology Group, Inc. 3 - -
Price on request
3
Distributor Stock MOQ Country
Components Technology Group, Inc. 3 - -
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - No - - - - - - - - - -
KAI-01050-ABA-FD-BA
KAI-01050-ABA-FD-BA
Download Datasheet for KAI-01050-ABA-FD-BA
On Semiconductor
3
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 3 - -
Price on request
3
Distributor Stock MOQ Country
Flip Electronics 3 - -
- - 5.632 mm x 5.632 mm - 1024H x 1024V - Interline CCD, Progressive Scan - 1:1 - - - - - - - - - - - - - - 64 dB - - - - - - - - - - - 120 - - - - - - - - - 18.29 mm - - - - - - - - - - 1, 2, or 4 - - -50°C ~ 70°C (TA) - - - - - 1/2" - - - - 34µV/e- - - - - - - - - 5.5µm x 5.5µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 64-CLCC (18.29x18.29) - - - - - - - - - - - - - - - - - CCD - - 14.5V ~ 15.5V - - -
NOIX2SN8000B-LTI1
NOIX2SN8000B-LTI1
On Semiconductor
3
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 3 - -
Price on request
3
Distributor Stock MOQ Country
Flip Electronics 3 - -
- - - - 4096H x 2160V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 128 fps - - - - - - - - - 20.88 mm - - - - - - - - - - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - - - - - 3.2µm x 3.2µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 163-CLGA (20.88x19.9) - - - - - - - - - - - - - - - - - CMOS - - 1.1V ~ 1.3V - - -
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC
On Semiconductor
2
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 2 - -
Price on request
2
Distributor Stock MOQ Country
Flip Electronics 2 - -
- - - - - - - - - - - - - - - - - - - - - - - - 40 Vita5000 - - - - - - - - - - - - - - CMOS - - - - 68 mm - - - - - - - - - Surface Mount - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2592x2048 Pixels - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
AR0134CSSM00SPCA0-DPBR2
AR0134CSSM00SPCA0-DPBR2
On Semiconductor
2
From Flip Electronics
Distributor Stock MOQ Country
Flip Electronics 2 - -
Price on request
2
Distributor Stock MOQ Country
Flip Electronics 2 - -
- - - - 1280H x 960V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 60 - - - - - - - - - - - - - - - - - - - - - - - -30°C to 70°C - - - - - - - - - - - - - - - - - - - 3.75µm x 3.75µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 48-iLCC (10x10) - 1.7V to 1.95V, 2.5V to 3.1V - - - - - - - - - - - No - - - CMOS - - 1.7V ~ 1.95V, 2.5V ~ 3.1V - - -
AR0330CM1C00SHAA0
AR0330CM1C00SHAA0
On Semiconductor
2
From Rayichip
Distributor Stock MOQ Country
Rayichip 2 - -
Price on request
2
Distributor Stock MOQ Country
Rayichip 2 - -
- - - - 2304H x 1296V - - - - - - - - - - - - - - - Four-lane Serial High-speed Pixel Interface (HiSPi) Differential Signaling (SLVS), Four-lane Serial MIPI Interface, or Parallel - - - - - - - - - - - - - - 60 fps - - - - - - - - - 0.5 mm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.2µm x 2.2µm - - - - - - - - - - - - - - - - - - - Simple Two-wire Serial Interface - - - - - - - - - - - - - - - - - - - - - No - - - CMOS - 1080p60 + 20% EIS (2304 (H) × 1296 (V)) 1.8V, 2.8V - - -
ARO543CSSC25SMKAO
ARO543CSSC25SMKAO
On Semiconductor
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AR0543CSSC25SMKA0
AR0543CSSC25SMKA0
On Semiconductor
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DEV-16260
DEV-16260
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SparkFun Electronics
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 - - - - 3280H x 2464V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -20°C ~ 60°C - - - - - - - - - - - - - - - - - - - 1.12µm x 1.12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1.08V ~ 3V - - -
M50230FP#DF1G
M50230FP#DF1G
Renesas
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S319SPX
S319SPX
Seek Thermal
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 27 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 60°C - - - - - - - - - - - - - - - - - - - 12µm x 12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - Module - - - - - - - - - - - - - - - - - Thermal - - 3.3V ~ 5V - - -
MT9M001C12STM-TH-DR
MT9M001C12STM-TH-DR
On Semiconductor
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MT9T001C12STC-DR
MT9T001C12STC-DR
On Semiconductor
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 - - - - 2048H x 1536V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 60°C - - - - - - - - - - - - - - - - - - - 3.2µm x 3.2µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 48-PLCC (14.22x14.22) - - - - - - - - - - - - - - - - - CMOS with Processor - - 3V ~ 3.6V - - -
MT9T001C12STC
MT9T001C12STC
On Semiconductor
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 - - - - 2048H x 1536V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 60°C - - - - - - - - - - - - - - - - - - - 3.2µm x 3.2µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 48-PLCC (14.22x14.22) - - - - - - - - - - - - - - - - - CMOS - - 3V ~ 3.6V - - -
UPD3739D-A
UPD3739D-A
Renesas
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S309SP
S309SP
Seek Thermal
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 9 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 60°C - - - - - - - - - - - - - - - - - - - 12µm x 12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - Module - - - - - - - - - - - - - - - - - Thermal - - 3.3V ~ 5V - - -
MT9V125IA7XTC-TR
MT9V125IA7XTC-TR
On Semiconductor
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MT9V024IA7XTR
MT9V024IA7XTR
On Semiconductor
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 - - - - 752H x 480V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 60 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6µm x 6µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 52-IBGA (9x9) - - - - - - - - - - - - - - - - - CMOS - - 3.3V - - -
TR-EVO-T33-USB
TR-EVO-T33-USB
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Terabee SAS
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 65°C - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Thermal - - 4.75V ~ 5.25V - - -
S304SP
S304SP
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Seek Thermal
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 9 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 60°C - - - - - - - - - - - - - - - - - - - 12µm x 12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - Module - - - - - - - - - - - - - - - - - Thermal - - 3.3V ~ 5V - - -
106680
106680
Basler Inc.
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 - - - - 1280H x 960V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 54 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 75°C - - - - - - - - - - - - - - - - - - - 3.75µm x 3.75µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 3.4V - - -
S312NPX
S312NPX
Seek Thermal
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 27 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 60°C - - - - - - - - - - - - - - - - - - - 12µm x 12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - Module - - - - - - - - - - - - - - - - - Thermal - - 3.3V ~ 5V - - -
TOFRANGE-611
TOFRANGE-611
ESPROS Photonics AG
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 - - - - 8H X 8V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1000 - - - - - - - - - - - - - - - - - - - - - - - -20°C ~ 85°C - - - - - - - - - - - - - - - - - - - 20µm x 20µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3D Time of Flight - - 4.75V ~ 5.25V - - -
MT9V034C12STM-DP1
MT9V034C12STM-DP1
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 - - - - 752H x 480V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 60 - - - - - - - - - - - - - - - - - - - - - - - -30°C ~ 70°C - - - - - - - - - - - - - - - - - - - 6µm x 6µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 48-PLCC (11.43x11.43) - - - - - - - - - - - - - - - - - CMOS - - 3V ~ 3.6V - - -
TR-EVO-3M-USB
TR-EVO-3M-USB
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Terabee SAS
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 100 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3D Time of Flight - - 4.75V ~ 5.25V - - -
EPC660-CSP68-011
EPC660-CSP68-011
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ESPROS Photonics AG
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 158 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - - - - - 20µm x 20µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 68-CSP (9.7x8.66) - - - - - - - - - - - - - - - - - CCD - - 2.25V ~ 3.63V - - -
LENTICULAR ARRAYS_LT02-10
LENTICULAR ARRAYS_LT02-10
Fresnel Factory Inc.
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TCD1304DG(8Z,K)
TCD1304DG(8Z,K)
Toshiba
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -25°C ~ 60°C - - - - - - - - - - - - - - - - - - - 8µm x 200µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 22-CERDIP - - - - - - - - - - - - - - - - - CCD - - - - - -
HM01B0-ANA-00FT870
HM01B0-ANA-00FT870
Himax Technologies
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 - - - - 320H x 320V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.6µm x 3.6µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 1.5V ~ 2.8V - - -
OV07251-A35A-1F
OV07251-A35A-1F
OmniVision Technologies Inc
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 - - - - 640H x 480V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 100 - - - - - - - - - - - - - - - - - - - - - - - -30°C ~ 70°C - - - - - - - - - - - - - - - - - - - 3µm x 3µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 35-CSP3 (3.91x3.41) - - - - - - - - - - - - - - - - - CMOS - - 2.8V - - -
CMV2000-3E12M1PP
CMV2000-3E12M1PP
Osram
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 - - - - 2048H x 1088V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 340 - - - - - - - - - - - - - - - - - - - - - - - -30°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 5.5µm x 5.5µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 95-MicroPGA - - - - - - - - - - - - - - - - - CMOS - - 1.8V, 3.3V - - -
MLX90640ESF-BAA-000-SP
MLX90640ESF-BAA-000-SP
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MELEXIS
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 - - - - 32H x 24V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - TO-39 - - - - - - - - - - - - - - - - - Thermal - - 2.9V ~ 3.6V - - -
HM0360-MWA-00FW703
HM0360-MWA-00FW703
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Himax Technologies
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 - - - - 640H x 480V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 60 - - - - - - - - - - - - - - - - - - - - - - - -20°C ~ 85°C - - - - - - - - - - - - - - - - - - - 3.6µm x 3.6µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS with Processor - - 1.2V ~ 2.8V - - -
S314SPX
S314SPX
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Seek Thermal
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 27 - - - - - - - - - - - - - - - - - - - - - - - -10°C ~ 60°C - - - - - - - - - - - - - - - - - - - 12µm x 12µm - - - - - - - - - - - - - - - - - - - - - - - - - - - Module - - - - - - - - - - - - - - - - - Thermal - - 3.3V ~ 5V - - -
BF3-5M-0315ZC-1N1010
BF3-5M-0315ZC-1N1010
Matrix Vision Gmbh.
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 - - - - 6480H x 4856V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12.1 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 3.45µm x 3.45µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
BF3-5M-0315ZC-100510
BF3-5M-0315ZC-100510
Matrix Vision Gmbh.
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 - - - - 6480H x 4856V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12.1 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 3.45µm x 3.45µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
OV09284-E64Y-RB-Z
OV09284-E64Y-RB-Z
OmniVision Technologies Inc
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
BF3-5M-0315ZG-100510
BF3-5M-0315ZG-100510
Matrix Vision Gmbh.
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 - - - - 6480H x 4856V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12.1 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 3.45µm x 3.45µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
BF3-5M-0196ZG-100510
BF3-5M-0196ZG-100510
Matrix Vision Gmbh.
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 - - - - 4432H x 4432V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 19.3 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 3.45µm x 3.45µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
HM0360-AWA
HM0360-AWA
Himax Technologies
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 - - - - 640H x 480V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 60 - - - - - - - - - - - - - - - - - - - - - - - -20°C ~ 85°C - - - - - - - - - - - - - - - - - - - 3.6µm x 3.6µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS with Processor - - 1.2V ~ 2.8V - - -
BF3-5M-0246AC-110510
BF3-5M-0246AC-110510
Matrix Vision Gmbh.
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 - - - - 5328H x 4608V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 26.2 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 2.74µm x 2.74µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
BF3-5M-0246AG-111010
BF3-5M-0246AG-111010
Matrix Vision Gmbh.
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 - - - - 5328H x 4608V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 26.2 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 2.74µm x 2.74µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
MLX75026STH-AAA-100-TR
MLX75026STH-AAA-100-TR
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 180 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 105°C - - - - - - - - - - - - - - - - - - - 10µm x 10µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 80-FCBGA (9.23x7.82) - - - - - - - - - - - - - - - - - 3D Time of Flight - - 1.1V ~ 1.3V - - -
OV20381-EAAC-AA0A
OV20381-EAAC-AA0A
OmniVision Technologies Inc
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
MLX75026STH-AAA-210-TR
MLX75026STH-AAA-210-TR
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 180 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 105°C - - - - - - - - - - - - - - - - - - - 10µm x 10µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 80-FCBGA (9.23x7.82) - - - - - - - - - - - - - - - - - 3D Time of Flight - - 1.1V ~ 1.3V - - -
MLX75026STH-AAA-200-TR
MLX75026STH-AAA-200-TR
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 - - - - 320H x 240V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 180 - - - - - - - - - - - - - - - - - - - - - - - -40°C ~ 105°C - - - - - - - - - - - - - - - - - - - 10µm x 10µm - - - - - - - - - - - - - - - - - - - - - - - - - - - 80-FCBGA (9.23x7.82) - - - - - - - - - - - - - - - - - 3D Time of Flight - - 1.1V ~ 1.3V - - -
BF3-5M-0246AC-100510
BF3-5M-0246AC-100510
Matrix Vision Gmbh.
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 - - - - 5328H x 4608V - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 26.2 - - - - - - - - - - - - - - - - - - - - - - - 0°C ~ 45°C - - - - - - - - - - - - - - - - - - - 2.74µm x 2.74µm - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - CMOS - - 10V ~ 28V - - -
Showing 401-450 of 2,157 products

About Optical Sensors - Image Sensors, Camera

Optical Sensors - Image Sensors, Camera are essential components in a wide range of applications, including industrial sensing, monitoring, and advanced imaging systems. These sensors convert light into electronic signals, enabling devices to capture images and detect motion with high precision.

Key attributes to consider when sourcing these sensors include Active Pixel Array, Frames per Second, Operating Temperature, and Pixel Size. Understanding these specifications is crucial for ensuring compatibility with your existing systems and meeting performance requirements.

Applications for Optical Sensors - Image Sensors, Camera span across new product design, prototyping, production electronics assembly, and maintenance. They are also vital for engineering evaluation and qualification processes, making them indispensable in the procurement-driven multi-sourcing environment.

When selecting Optical Sensors, prioritize comparing critical specifications first. Validate lifecycle status and explore alternate-source options before submitting a Request for Quotation (RFQ). It is also important to confirm mechanical and electrical compatibility with your design constraints to minimize sourcing risks.

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