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Microprocessors

Microprocessors facilitate the processing of data in embedded systems, serving as the core component for various electronic applications. Key attributes include Core Processor, Number of Cores, and Operating Temperature, which are critical for performance and compatibility. These components are essential for new product design and prototyping, ensuring efficient operation in diverse environments.

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What are Microprocessors ?

Microprocessors are integrated circuits that serve as the central processing unit (CPU) in embedded systems, executing instructions and managing data flow. They are widely used in applications such as production electronics assembly and maintenance. Important specifications for selection include the Core Processor, which determines processing power; the Number of Cores, which affects multitasking capabilities; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Access Time Architecture Clock Frequency Co Communications Connectivity Core Processor Core Size Dimensions Display & Interface Controllers Display Type Ethernet Failure Rate Features Frequency Function GPIO Graphics Acceleration Halogen Free Height Industrial Grade Interface Lead Spacing Lead Style Length Memory Interface Memory Size Memory Type Mounting Style Mounting Type Number of Bits Number of Cores Number of Pins Number of Positions Operating System Operating Temperature Operating Temperature Range Operating Voltage Oscillator Type PLL Package / Case Package Quantity Peripherals Pitch Power Consumption Power Dissipation Processor Type Program Memory Size Program Memory Type RAM Controllers RAM Size SATA SVHC Present Security Features Serial Interfaces Speed Storage Temperature Supplier Device Package Supplier Package Supply Voltage Tape & Reel Technology Termination Style USB Voltage Voltage Supply Watchdog Timer Weight Width
R8A77210C133BAV
R8A77210C133BAV
Renesas
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 - - - - - - SH-3 DSP - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -20°C ~ 75°C (TA) - - - - - - - - - - - - - - - - - - - 133MHz - 256-LFBGA (11x11) - - - - - - 3.3V - - - -
NG80960JC66
NG80960JC66
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Intel
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 - - - - - - i960 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 100°C (TC) - - - - - - - - - - - - - - - - - - - 66MHz - 132-PQFP (24.13x24.13) - - - - - - 3.3V - - - -
A80960HA33SL2GY
A80960HA33SL2GY
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Intel
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 - - - - - - i960 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 85°C (TC) - - - - - - - - - - - - - DRAM - - - - - 33MHz - 168-PGA - - - - - - 3.3V - - - -
UG80960HD6616SL2GN
UG80960HD6616SL2GN
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Intel
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 - - - - - - i960 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 85°C (TC) - - - - - - - - - - - - - DRAM - - - - - 66MHz - 208-SQFP (28x28) - - - - - - 3.3V - - - -
KC80524KX366128SL3C7
KC80524KX366128SL3C7
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Intel
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 - - - - - - - - - - - - - - - - - No - - - - - - - - - - - Surface Mount - - - - - 0°C ~ 100°C (TJ) - - - - - - - - - - - - - - - - - - - 366MHz - 615-BGA (35.15x31.15) - - - - - - - - - - -
FW80321M400SL6R2
FW80321M400SL6R2
Intel
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 - - - - - - Xscale - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TC) - - - - - - - - - - - - - DDR - - - - - 400MHz - 544-BGA (35x35) - - - - - - 2.5V, 3.3V - - - -
AM6546BACDXA
AM6546BACDXA
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Texas Instruments
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 - - - GPU PowerVR SGX544-MP1 3D - - ARM® Cortex®-A53, Arm® Cortex®-R5F - - LVDS, MIPI-CSI - 10/100/1000Mbps (2) - - - - - Yes - - - - - - - - - - - Surface Mount - 6 Core, 32-Bit - - - -40°C ~ 105°C (TJ) - - - - - - - - - - - - - DDR3, DDR4, LPDDR4 - - - 3DES, AES, DRBG, MD5, PKA, SHA - 1.1GHz, 400MHz - 784-FCBGA (23x23) - - - - - USB 2.0 (1), USB 3.1 (1) 1.2V, 1.35V, 1.8V, 3.3V - - - -
GCIXP1250BB
GCIXP1250BB
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Intel
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 - - - Data; Microengine - - StrongARM - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - SDRAM - - - - - 200MHz - 520-HL-PBGA (40x40) - - - - - - 3.3V - - - -
GCIXP1250BC
GCIXP1250BC
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Intel
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 - - - Data; Microengine - - StrongARM - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - SDRAM - - - - - 232MHz - 520-HL-PBGA (40x40) - - - - - - 3.3V - - - -
ICM7228CIJI
ICM7228CIJI
Harris Semiconductor
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
AM1707BZKB3
AM1707BZKB3
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Texas Instruments
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 - - - System Control; CP15 - - ARM926EJ-S - - LCD - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - SDRAM - - - - - 375MHz - 256-BGA (17x17) - - - - - USB 1.1 + PHY (1), USB 2.0 + PHY (1) 1.8V, 3.3V - - - -
AM1705BPTP3
AM1705BPTP3
Texas Instruments
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 - - - System Control; CP15 - - ARM926EJ-S - - - - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - SDRAM - - - - - 375MHz - 176-HLQFP (24x24) - - - - - USB 2.0 + PHY (1) 1.8V, 3.3V - - - -
AM1705CPTP3
AM1705CPTP3
Texas Instruments
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 - - - System Control; CP15 - - ARM926EJ-S - - - - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - SDRAM - - - - - 375MHz - 176-HLQFP (24x24) - - - - - USB 2.0 + PHY (1) 1.8V, 3.3V - - - -
MCIMX6Y0DVM05AB557
MCIMX6Y0DVM05AB557
NXP Semiconductors
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 - - - Multimedia; NEON™ MPE - - ARM® Cortex®-A7 - - Electrophoretic, LCD - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TJ) - - - - - - - - - - - - - LPDDR2, DDR3, DDR3L - - - A-HAB, ARM TZ, CSU, SJC, SNVS - 528MHz - 289-MAPBGA (14x14) - - - - - USB 2.0 OTG + PHY (1) 1.8V, 2.8V, 3.3V - - - -
MC9328MXLVP15R2
MC9328MXLVP15R2
Freescale Semiconductor
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 - - - - - - ARM920T - - LCD - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - SDRAM - - - - - 150MHz - 225-MAPBGA (13x13) - - - - - USB 1.x (1) 1.8V, 3.0V - - - -
AM1705BPTP4
AM1705BPTP4
Texas Instruments
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 - - - System Control; CP15 - - ARM926EJ-S - - - - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - SDRAM - - - - - 456MHz - 176-HLQFP (24x24) - - - - - USB 2.0 + PHY (1) 1.8V, 3.3V - - - -
MC68EC000FU16
MC68EC000FU16
Motorola Semicondutor
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
MCIMX7S3DVK08SC
MCIMX7S3DVK08SC
NXP Semiconductors
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 - - - Multimedia; NEON™ MPE - - ARM® Cortex®-A7, ARM® Cortex®-M4 - - Keypad, LCD, MIPI - 10/100/1000Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TJ) - - - - - - - - - - - - - LPDDR2, LPDDR3, DDR3, DDR3L - - - A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS - 800MHz - 488-FBGA (12x12) - - - - - USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) 1.8V, 3.3V - - - -
MPC8306CVMACDCA557
MPC8306CVMACDCA557
Download Datasheet for MPC8306CVMACDCA557
NXP Semiconductors
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PLS1012ASE7HKA
PLS1012ASE7HKA
NXP Semiconductors
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 - - - - - - ARM® Cortex®-A53 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 64-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3L - SATA 6Gbps (1) - ARM TZ - 800MHz - 211-FCLGA (9.6x9.6) - - - - - USB 2.0 (1), USB 3.0 + PHY - - - - -
MPC8309VMAFDCA
MPC8309VMAFDCA
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NXP Semiconductors
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 - - - Communications; QUICC Engine - - PowerPC e300c3 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR2 - - - - - 333MHz - 489-PBGA (19x19) - - - - - USB 2.0 (1) 1.8V, 3.3V - - - -
MPC8309CVMADDCA
MPC8309CVMADDCA
Download Datasheet for MPC8309CVMADDCA
NXP Semiconductors
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 - - - Communications; QUICC Engine - - PowerPC e300c3 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR2 - - - - - 266MHz - 489-PBGA (19x19) - - - - - USB 2.0 (1) 1.8V, 3.3V - - - -
MPC8321EVRAFDCA
MPC8321EVRAFDCA
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NXP Semiconductors
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 - - - Communications; QUICC Engine, Security; SEC 2.2 - - PowerPC e300c2 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR, DDR2 - - - Cryptography - 333MHz - 516-PBGA (27x27) - - - - - USB 2.0 (1) 1.8V, 2.5V, 3.3V - - - -
MPC8271ZQMIBA
MPC8271ZQMIBA
NXP Semiconductors
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
P1014NSN5FFB
P1014NSN5FFB
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NXP Semiconductors
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 - - - - - - PowerPC e500v2 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 800MHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
P1014NSN5HFB
P1014NSN5HFB
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NXP Semiconductors
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 - - - - - - PowerPC e500v2 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 800MHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
P1014NSE5HFB
P1014NSE5HFB
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NXP Semiconductors
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 - - - Security; SEC 4.4 - - PowerPC e500v2 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - Boot Security, Cryptography, Random Number Generator, Secure Fusebox - 800MHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
P1014NSE5HHB
P1014NSE5HHB
Download Datasheet for P1014NSE5HHB
NXP Semiconductors
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 - - - Security; SEC 4.4 - - PowerPC e500v2 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - Boot Security, Cryptography, Random Number Generator, Secure Fusebox - 800MHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
LS1024ASN7ELA
LS1024ASN7ELA
Download Datasheet for LS1024ASN7ELA
NXP Semiconductors
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 - - - - - - ARM® Cortex®-A9 - - - - GbE (3) - - - - - - - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DDR3 - SATA 3Gbps (2) - Secure Boot, TrustZone® - 1.2GHz - 625-FCPBGA (21x21) - - - - - USB 2.0 + PHY (1), USB 3.0 + PHY - - - - -
P1021NSE2DFB
P1021NSE2DFB
NXP Semiconductors
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 - - - Communications; QUICC Engine, Security; SEC 3.3 - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 125°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - - - Cryptography, Random Number Generator - 533MHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (1) - - - - -
LS1024ASN7JLA
LS1024ASN7JLA
NXP Semiconductors
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 - - - - - - ARM® Cortex®-A9 - - - - GbE (3) - - - - - - - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DDR3 - SATA 3Gbps (2) - Secure Boot, TrustZone® - 1.2GHz - 625-FCPBGA (21x21) - - - - - USB 2.0 + PHY (1), USB 3.0 + PHY - - - - -
P1014NXE5HFB
P1014NXE5HFB
Download Datasheet for P1014NXE5HFB
NXP Semiconductors
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 - - - Security; SEC 4.4 - - PowerPC e500v2 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - Boot Security, Cryptography, Random Number Generator, Secure Fusebox - 800MHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
MPC8378ECVRAGDA
MPC8378ECVRAGDA
NXP Semiconductors
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 - - - Security; SEC 3.0 - - PowerPC e300c4s - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 125°C (TJ) - - - - - - - - - - - - - DDR, DDR2 - - - Cryptography, Random Number Generator - 400MHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (1) 1.8V, 2.5V, 3.3V - - - -
P1021NSN2DFB
P1021NSN2DFB
Freescale Semiconductor
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 - - - Communications; QUICC Engine - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 125°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - - - - - 800MHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (2) - - - - -
MIMX8MD6CVAHZAA
MIMX8MD6CVAHZAA
Download Datasheet for MIMX8MD6CVAHZAA
NXP Semiconductors
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 - - - ARM® Cortex®-M4 - - ARM® Cortex®-A53 - - eDP, HDMI, MIPI-CSI, MIPI-DSI - GbE - - - - - Yes - - - - - - - - - - - Surface Mount - 2 Core, 64-Bit - - - -40°C ~ 105°C (TJ) - - - - - - - - - - - - - DDR3L, DDR4, LPDDR4 - - - ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS - 1.3GHz - 621-FCPBGA (17x17) - - - - - USB 3.0 (2) - - - - -
MC68EC000EI10
MC68EC000EI10
Freescale Semiconductor
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 - - - - - - EC000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 10MHz - 68-PLCC (24.21x24.21) - - - - - - 5.0V - - - -
MPC8377EVRAGDA
MPC8377EVRAGDA
Download Datasheet for MPC8377EVRAGDA
NXP Semiconductors
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 - - - Security; SEC 3.0 - - PowerPC e300c4s - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 125°C (TA) - - - - - - - - - - - - - DDR, DDR2 - SATA 3Gbps (2) - Cryptography, Random Number Generator - 400MHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (1) 1.8V, 2.5V, 3.3V - - - -
LS1027AXE7PQA
LS1027AXE7PQA
NXP Semiconductors
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 - - - - - - ARM® Cortex®-A72 - - - - 1Gbps (1), 2.5Gbps (5) - - - - - Yes - - - - - - - - - - - Surface Mount - 2 Core, 64-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3L, DDR4 - SATA 6Gbps (1) - Secure Boot, TrustZone® - 1.5GHz - 448-FBGA (17x17) - - - - - USB 3.0 (2) - - - - -
SCP2207VMU
SCP2207VMU
Download Datasheet for SCP2207VMU
NXP Semiconductors
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 - - - - - - ARM926EJ-S - - LCD - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR, SDRAM - - - Cryptography - - - 236-MAPBGA (9x9) - - - - - USB 2.0 OTG (1) 1.8V, 2.5V, 3.3V - - - -
MPC8533VTAQGA
MPC8533VTAQGA
NXP Semiconductors
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P2010NSN2HFC
P2010NSN2HFC
NXP Semiconductors
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 - - - - - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 125°C (TJ) - - - - - - - - - - - - - DDR2, DDR3 - - - - - 800MHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (2) 1.5V, 1.8V, 2.5V, 3.3V - - - -
MC68020CEH25E-G
MC68020CEH25E-G
Rochester Electronics
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 - - - - - - M68000 - - - - - - - - - - No - - - - - - - - - - - - - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - - - - - - - - 5V - - - -
P1022NSE2HFB
P1022NSE2HFB
Freescale Semiconductor
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 - - - Security; SEC - - PowerPC e500v2 - - LCD - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - SATA 3Gbps (2) - Cryptography, Random Number Generator - 1.055GHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (2) - - - - -
MPC860DTVR50D4
MPC860DTVR50D4
Download Datasheet for MPC860DTVR50D4
NXP Semiconductors
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 - - - Communications; CPM - - MPC8xx - - - - 10Mbps (2), 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TA) - - - - - - - - - - - - - DRAM - - - - - 50MHz - 357-PBGA (25x25) - - - - - - 3.3V - - - -
MPC8544EVTALFA557
MPC8544EVTALFA557
NXP Semiconductors
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MPC8347ECVRADDB
MPC8347ECVRADDB
Download Datasheet for MPC8347ECVRADDB
Freescale Semiconductor
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 - - - Security; SEC - - PowerPC e300 - - - - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR - - - Cryptography, Random Number Generator - 266MHz - 620-HBGA (29x29) - - - - - USB 2.0 + PHY (2) 2.5V, 3.3V - - - -
MPC8358CVRAGDDA
MPC8358CVRAGDDA
Download Datasheet for MPC8358CVRAGDDA
NXP Semiconductors
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 - - - Communications; QUICC Engine - - PowerPC e300 - - - - 10/100/1000Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR, DDR2 - - - - - 400MHz - 668-PBGA-PGE (29x29) - - - - - USB 1.x (1) 1.8V, 2.5V, 3.3V - - - -
P1013NSE2MHB
P1013NSE2MHB
Freescale Semiconductor
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 - - - Security; SEC - - PowerPC e500v2 - - LCD - 10/100/1000Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - SATA 3Gbps (2) - Cryptography, Random Number Generator - 1.055GHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (2) - - - - -
MPC8536AVTANGA557
MPC8536AVTANGA557
NXP Semiconductors
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MPC8358CVVAGDGA
MPC8358CVVAGDGA
NXP Semiconductors
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 - - - Communications; QUICC Engine - - PowerPC e300 - - - - 10/100/1000Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR, DDR2 - - - - - 400MHz - 740-TBGA (37.5x37.5) - - - - - USB 1.x (1) 1.8V, 2.5V, 3.3V - - - -
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About Microprocessors

Microprocessors serve as the core processing units in embedded systems, playing a crucial role in various applications such as new product design, prototyping, and production electronics assembly. These components are designed to execute instructions and manage data flow, making them integral to the functionality of electronic devices.

When sourcing microprocessors, it is important to consider key attributes such as core processor type, number of cores, operating temperature, and mounting type. These specifications directly impact the performance and compatibility of the microprocessor with existing designs. Additionally, understanding the lifecycle status of the components and exploring alternate-source options can mitigate sourcing risks.

Applications for microprocessors include engineering evaluation and qualification, maintenance and field replacement, and procurement-driven multi-sourcing. Buyers should prioritize parametric filtering based on critical specifications before brand preference to ensure optimal selection for their projects.

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