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Microprocessors

Microprocessors facilitate the processing of data in embedded systems, serving as the core component for various electronic applications. Key attributes include Core Processor, Number of Cores, and Operating Temperature, which are critical for performance and compatibility. These components are essential for new product design and prototyping, ensuring efficient operation in diverse environments.

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What are Microprocessors ?

Microprocessors are integrated circuits that serve as the central processing unit (CPU) in embedded systems, executing instructions and managing data flow. They are widely used in applications such as production electronics assembly and maintenance. Important specifications for selection include the Core Processor, which determines processing power; the Number of Cores, which affects multitasking capabilities; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Access Time Architecture Clock Frequency Co Communications Connectivity Core Processor Core Size Dimensions Display & Interface Controllers Display Type Ethernet Failure Rate Features Frequency Function GPIO Graphics Acceleration Halogen Free Height Industrial Grade Interface Lead Spacing Lead Style Length Memory Interface Memory Size Memory Type Mounting Style Mounting Type Number of Bits Number of Cores Number of Pins Number of Positions Operating System Operating Temperature Operating Temperature Range Operating Voltage Oscillator Type PLL Package / Case Package Quantity Peripherals Pitch Power Consumption Power Dissipation Processor Type Program Memory Size Program Memory Type RAM Controllers RAM Size SATA SVHC Present Security Features Serial Interfaces Speed Storage Temperature Supplier Device Package Supplier Package Supply Voltage Tape & Reel Technology Termination Style USB Voltage Voltage Supply Watchdog Timer Weight Width
MC68HC001FN12
MC68HC001FN12
Motorola Semicondutor
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 - - - - - - MC68HC001 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 16/32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 12MHz - 68-PLCC (24.21x24.21) - - - - - - 5V - - - -
MC68EC000FU20
MC68EC000FU20
Motorola Semicondutor
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 - - - - - - 68EC000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 20MHz - 64-QFP (14x14) - - - - - - 5V - - - -
MC68HC000IFN16R2
MC68HC000IFN16R2
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MCF5206CFT16A
MCF5206CFT16A
Motorola Semicondutor
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 160-QFP (28x28) - - - - - - 5V - - - -
MCF5206FT25A
MCF5206FT25A
Motorola Semicondutor
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 160-QFP (28x28) - - - - - - 5V - - - -
TD8088
TD8088
Intel
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 - - - - - - 8088 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 8-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 5MHz - 40-CDIP - - - - - - 5V - - - -
XPC850ZT66BU
XPC850ZT66BU
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 - - - Communications; CPM - - MPC8xx - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TA) - - - - - - - - - - - - - DRAM - - - - - 66MHz - 256-PBGA (23x23) - - - - - USB 1.x (1) 3.3V - - - -
MG80C186XL-20/R
MG80C186XL-20/R
Rochester Electronics
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 - - - - - - 80C186 - - - - - - - - - - No - - - - - - - - - - - - - 1 Core, 16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - - - - - - - - 5.0V - - - -
SM768GX000000-AB
SM768GX000000-AB
Download Datasheet for SM768GX000000-AB
Silicon Motion
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 - - - - - - GPU - - - - - - - - - - Yes - - - - - - - - - - - - - 1 Core - - - 0°C ~ 70°C - - - - - - - - - - - - - DDR3 - - - - - 340MHz - 425-BGAMCM (19x19) - - - - - USB 2.0 (4), USB 3.0 (1) - - - - -
R9A07G054L23GBG#AC0
R9A07G054L23GBG#AC0
Renesas
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 - - - ARM® Mali-G31, Multimedia; NEON™ SIMD - - ARM® Cortex®-A55, ARM® Cortex®-M33 - - LCD, MIPI/CSI, MIPI/DSI - 10/100/1000Mbps (2) - - - - - Yes - - - - - - - - - - - Surface Mount - 3 Core, 64-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DDR3L, DDR4 - - - - - 200MHz, 1.2GHz - 456-LFBGA (15x15) - - - - - USB 2.0 (2) 1.8V, 3.3V - - - -
NG80960JF3V33
NG80960JF3V33
Intel
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 - - - - - - i960 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 100°C (TC) - - - - - - - - - - - - - - - - - - - 33MHz - 132-QFP - - - - - - 3.3V - - - -
P1010NXN5DFA
P1010NXN5DFA
Freescale Semiconductor
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 - - - - - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 1.0GHz - 425-TEPBGA I (19x19) - - - - - USB 2.0 + PHY (1) - - - - -
SM750GE000000-AC
SM750GE000000-AC
Download Datasheet for SM750GE000000-AC
Silicon Motion
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 - - - - - - LynxExpress - - DMA, DVO, TMDS, LVDS - - - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core - - - -40°C ~ 85°C - - - - - - - - - - - - - DDR - - - - - 300MHz - 265-BGA (17x17) - - - - - USB 3.0 - - - - -
R9A07G054L24GBG#AC0
R9A07G054L24GBG#AC0
Renesas
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 - - - ARM® Mali-G31, Multimedia; NEON™ SIMD - - ARM® Cortex®-A55, ARM® Cortex®-M33 - - LCD, MIPI/CSI, MIPI/DSI - 10/100/1000Mbps (2) - - - - - Yes - - - - - - - - - - - Surface Mount - 3 Core, 64-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DDR3L, DDR4 - - - - - 200MHz, 1.2GHz - 551-LFBGA (21x21) - - - - - USB 2.0 (2) 1.8V, 3.3V - - - -
AM5749ABZX
AM5749ABZX
Texas Instruments
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 - - - ARM® Cortex®-M4, C66x - - ARM® Cortex®-A15 - - HDMI, LCD, Video - GbE (2) - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (1) - ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure RTC - 1.5GHz - 760-FCBGA (23x23) - - - - - USB 2.0 (2), USB 3.0 (2) 1.35V, 1.5V, 1.8V, 3.3V - - - -
MPC859DSLVR66A-NXP
MPC859DSLVR66A-NXP
NXP Semiconductors
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P1016NSN5DFB
P1016NSN5DFB
Freescale Semiconductor
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 - - - Communications; QUICC Engine - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 125°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - - - - - 667MHz - 561-TEPBGA I (23x23) - - - - - USB 2.0 + PHY (2) - - - - -
MPC880CVR133-NXP
MPC880CVR133-NXP
NXP Semiconductors
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MPC5200BV400
MPC5200BV400
Motorola Semicondutor
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 - - - - - - PowerPC G2_LE - - - - 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DDR, SDRAM - - - - - 400MHz - 272-PBGA (27x27) - - - - - USB 1.1 (2) 2.5V, 3.3V - - - -
MCIMX6D4AVT08AC-NXP
MCIMX6D4AVT08AC-NXP
NXP Semiconductors
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AM5748ABZX
AM5748ABZX
Texas Instruments
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 - - - ARM® Cortex®-M4, C66x - - ARM® Cortex®-A15 - - HDMI, LCD, Video - GbE (2) - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 90°C (TJ) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (1) - ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure RTC - 1.5GHz - 760-FCBGA (23x23) - - - - - USB 2.0 (2), USB 3.0 (2) 1.35V, 1.5V, 1.8V, 3.3V - - - -
MPC859TVR133A-NXP
MPC859TVR133A-NXP
NXP Semiconductors
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
FR80486GXSF33
FR80486GXSF33
Intel
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
LS1043ASE7MNLB
LS1043ASE7MNLB
Download Datasheet for LS1043ASE7MNLB
NXP Semiconductors
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 - - - - - - ARM® Cortex®-A53 - - - - 1GbE (7) or 10GbE (1) & 1GbE (5) - - - - - - - - - - - - - - - - - Surface Mount - 4 Core, 64-Bit - - - 0°C ~ 105°C - - - - - - - - - - - - - DDR3L, DDR4 - SATA 6Gbps (1) - Secure Boot, TrustZone® - 1.2GHz - 621-FCPBGA (21x21) - - - - - USB 3.0 (3) + PHY - - - - -
XPC8255VVIFBC
XPC8255VVIFBC
Freescale Semiconductor
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 - - - Communications; RISC CPM - - PowerPC G2 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DRAM, SDRAM - - - - - 200MHz - 480-TBGA (37.5x37.5) - - - - - - 3.3V - - - -
P2020PSE2HZB
P2020PSE2HZB
Freescale Semiconductor
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 - - - Security; SEC 3.3 - - PowerPC e500v2 - - - - 10/100/1000Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 32-Bit - - - 0°C ~ 125°C (TA) - - - - - - - - - - - - - DDR2, DDR3 - - - Cryptography, Random Number Generator - 1.2GHz - 689-TEPBGA II (31x31) - - - - - USB 2.0 + PHY (2) - - - - -
MPC8245TVV300D-NXP
MPC8245TVV300D-NXP
NXP Semiconductors
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MPC8271CVRTIEA
MPC8271CVRTIEA
Download Datasheet for MPC8271CVRTIEA
NXP Semiconductors
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 - - - Communications; RISC CPM - - PowerPC G2_LE - - - - 10/100Mbps (2) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DRAM, SDRAM - - - - - 400MHz - 516-PBGA (27x27) - - - - - USB 2.0 (1) 3.3V - - - -
MC7447RX733NB
MC7447RX733NB
Motorola Semicondutor
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 - - - - - - PowerPC - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TJ) - - - - - - - - - - - - - - - - - - - 733MHz - 360-CBGA (25x25) - - - - - - - - - - -
MPC855TZQ50D4
MPC855TZQ50D4
Motorola Semicondutor
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 - - - Communications; CPM - - MPC8xx - - - - 10Mbps (1), 10/100Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TA) - - - - - - - - - - - - - DRAM - - - - - 50MHz - 357-PBGA (25x25) - - - - - - 3.3V - - - -
MC68030RC33C
MC68030RC33C
Motorola Semicondutor
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 - - - - - - 68030 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 33MHz - 128-PGA (34.55x34.55) - - - - - - 5.0V - - - -
LLVT7004F108
LLVT7004F108
Intel
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MC68EC040FE40A
MC68EC040FE40A
Motorola Semicondutor
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 - - - - - - 68040 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 40MHz - 184-CQFP (31.3x31.3) - - - - - - 5V - - - -
MC68HC000CRC8
MC68HC000CRC8
Motorola Semicondutor
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 - - - - - - EC000 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - - - - - - - 8MHz - 68-PGA (26.92x26.92) - - - - - - 5.0V - - - -
MC68EC060RC50
MC68EC060RC50
Motorola Semicondutor
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 - - - - - - 68060 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 50MHz - 206-PGA (47.25x47.25) - - - - - - 5V - - - -
P2041NXN1MMB
P2041NXN1MMB
Freescale Semiconductor
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 - - - - - - PowerPC e500mc - - - - 10/100/1000Mbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - - - 4 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 1.2GHz - 780-FCPBGA (23x23) - - - - - USB 2.0 + PHY (2) 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V - - - -
XPC8260CZUIHBC
XPC8260CZUIHBC
Freescale Semiconductor
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 - - - Communications; RISC CPM - - PowerPC G2 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DRAM, SDRAM - - - - - 200MHz - 480-TBGA (37.5x37.5) - - - - - - 3.3V - - - -
5962-8850101YA
5962-8850101YA
Intel
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 - - - - - - M80C86 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 16-Bit - - - -55°C ~ 125°C (TC) - - - - - - - - - - - - - - - - - - - 10MHz - 68-CQFP (24.2x24.2) - - - - - - 5V - - - -
P3041NXE1MMB
P3041NXE1MMB
Freescale Semiconductor
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 - - - Security; SEC 4.2 - - PowerPC e500mc - - - - 10/100/1000Mbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 4 Core, 32-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - Boot Security, Cryptography, Random Number Generator, Secure Fusebox - 1.2GHz - 1295-FCPBGA (37.5x37.5) - - - - - USB 2.0 + PHY (2) 1.5V, 1.8V, 2.5V, 3.3V - - - -
MPC8260AZUPJDB-NXP
MPC8260AZUPJDB-NXP
NXP Semiconductors
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 - - - Communications; RISC CPM - - PowerPC G2 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DRAM, SDRAM - - - - - 300MHz - 480-TBGA (37.5x37.5) - - - - - - 3.3V - - - -
P5010NSN7MMB557-NXP
P5010NSN7MMB557-NXP
NXP Semiconductors
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MC68EC060RC66
MC68EC060RC66
Motorola Semicondutor
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 - - - - - - 68060 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 66MHz - 206-PGA (47.25x47.25) - - - - - - 3.3V - - - -
P5020NSN1TNB
P5020NSN1TNB
Freescale Semiconductor
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 - - - - - - PowerPC e5500 - - - - 1Gbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 64-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 2.0GHz - 1295-FCPBGA (37.5x37.5) - - - - - USB 2.0 + PHY (2) - - - - -
P5010NSN1TNB
P5010NSN1TNB
Freescale Semiconductor
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 - - - - - - PowerPC e5500 - - - - 1Gbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 64-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 2.0GHz - 1295-FCPBGA (37.5x37.5) - - - - - USB 2.0 + PHY (2) - - - - -
P5010NSN1QMB
P5010NSN1QMB
Freescale Semiconductor
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P5010NSN7QMB557
P5010NSN7QMB557
NXP Semiconductors
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P5020NXN1QMB
P5020NXN1QMB
Freescale Semiconductor
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 - - - - - - PowerPC e5500 - - - - 1Gbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 2 Core, 64-Bit - - - -40°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - - - 2.0GHz - 1295-FCPBGA (37.5x37.5) - - - - - USB 2.0 + PHY (2) - - - - -
P5010NSE1QMB
P5010NSE1QMB
Freescale Semiconductor
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 - - - Security; SEC 4.2 - - PowerPC e5500 - - - - 1Gbps (5), 10Gbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 64-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (2) - Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection - 2.0GHz - 1295-FCPBGA (37.5x37.5) - - - - - USB 2.0 + PHY (2) - - - - -
P5010NSE7QMB557-NXP
P5010NSE7QMB557-NXP
NXP Semiconductors
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P5010NSN7TNB557-NXP
P5010NSN7TNB557-NXP
NXP Semiconductors
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About Microprocessors

Microprocessors serve as the core processing units in embedded systems, playing a crucial role in various applications such as new product design, prototyping, and production electronics assembly. These components are designed to execute instructions and manage data flow, making them integral to the functionality of electronic devices.

When sourcing microprocessors, it is important to consider key attributes such as core processor type, number of cores, operating temperature, and mounting type. These specifications directly impact the performance and compatibility of the microprocessor with existing designs. Additionally, understanding the lifecycle status of the components and exploring alternate-source options can mitigate sourcing risks.

Applications for microprocessors include engineering evaluation and qualification, maintenance and field replacement, and procurement-driven multi-sourcing. Buyers should prioritize parametric filtering based on critical specifications before brand preference to ensure optimal selection for their projects.

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