What are Microcontrollers, Microprocessor, FPGA Modules ?
Microcontrollers, Microprocessor, FPGA Modules are integrated circuits designed to manage and control electronic devices. They are commonly used in embedded control systems, new product design, and production electronics assembly. Important specifications for selection include Core Processor, which determines processing power; Flash Size, which affects data storage capacity; and Operating Temperature, which ensures reliability under specific environmental conditions. Validating lifecycle status and exploring alternate-source options are crucial for procurement teams to mitigate sourcing risks.
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| Part & Mfr | Co | Connector Type | Core Processor | Flash Size | Module | Operating Temperature | RAM Size | Size | Speed | |||
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Digi
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- | 2 IDC Headers 2x17 | Rabbit 3000 | 512KB | MPU Core | -40°C ~ 70°C | 768KB | 1.850" L x 2.730" W (47.00mm x 69.00mm) | 44.2MHz | |
Octavo Systems LLC
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- | DSI | STM32MP157F | - | MPU Core | -20°C ~ 85°C | 512MB | 0.710" L x 0.710" W (18.00mm x 18.00mm) | 800MHz | |
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FTDI, Future Technology Devices International Ltd
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- | USB - B, Pin Header | PIC16F8722 | 128KB | - | - | 3.75KB | 2.800" L x 2.000" W (71.10mm x 50.80mm) | - | |
DLP Design Inc.
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FT245RL | USB - B, Pin Header | PIC16F8722 | 128KB | MCU, USB Core | - | 3.75KB | 2.800" L x 2.000" W (71.10mm x 50.80mm) | 24MHz | |
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Zilog
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- | Header 2x25 | eZ80F92 | 128KB | MCU Core | 0°C ~ 70°C | 8KB (Internal), 512KB (External) | 2.500" L x 2.500" W (64.00mm x 64.00mm) | 20MHz | |
Lantronix, Inc.
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XPort Direct+ | RJ45 | DSTni-EX | 512KB | MPU Core | -40°C ~ 85°C | 256KB | 1.250" L x 1.700" W (31.80mm x 43.30mm) | 25MHz | |
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Wandboard. Org
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- | EDM Connector | ARM® Cortex®-A9, i.MX6Solo | - | MPU Core | - | 512MB | 2.360" L x 3.230" W (60.00mm x 82.00mm) | - | |
Trenz Electronic
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Zynq-7000 (Z-7010) | 40 Pin | ARM Cortex-A9 | 16MB | MCU, FPGA | 0°C ~ 70°C | - | 0.710" L x 2.010" W (18.00mm x 51.00mm) | 33MHz | |
Future Designs Inc.
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- | SO-DIMM-200 | RX600, RX63N | 2MB | MCU Core | - | 128KB | - | 100MHz | |
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Wandboard. Org
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- | EDM Connector | ARM® Cortex®-A9, i.MX6DualLite | - | MPU Core | - | 1GB | 2.360" L x 3.230" W (60.00mm x 82.00mm) | - | |
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FTDI, Future Technology Devices International Ltd
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- | USB - B, Pin Header | Spartan-3E, XC3S250E | - | FPGA Core | - | 128KB | - | - | |
Critical Link LLC
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NEON SIMD | SO-DIMM-204 | ARM® Cortex®-A8, AM3352 | 256MB | MPU Core | 0°C ~ 70°C | 256MB | 2.660" L x 1.500" W (67.60mm x 38.10mm) | 800MHz | |
Trenz Electronic
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Zynq-7000 (Z-7010) | B2B | ARM Cortex-A9 | 16MB | MCU, FPGA | 0°C ~ 70°C | 512MB | - | 12MHz | |
Trenz Electronic
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- | Samtec LSHM | Artix-7 A35T | 32MB | FPGA Core | 0°C ~ 70°C | 512MB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 100MHz | |
Critical Link LLC
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NEON SIMD | SO-DIMM-204 | ARM® Cortex®-A8, AM3352 | 512MB | MPU Core | 0°C ~ 70°C | 512MB | 2.660" L x 1.500" W (67.60mm x 38.10mm) | 800MHz | |
Numato Lab
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Numato Lab
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Numato Lab
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Numato Lab
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Numato Lab
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Numato Lab
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Numato Lab
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Numato Lab
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Digi
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- | 2 IDC Headers 2x26 | Rabbit 2000 | 256KB | MPU Core | -40°C ~ 85°C | 128KB | 1.150" L x 1.600" W (29.00mm x 41.00mm) | 22.1MHz | |
Digi
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- | IDC Header 2x20 | Rabbit 3000 | 512KB | MPU Core | -40°C ~ 85°C | 512KB | 1.230" L x 2.110" W (31.00mm x 54.00mm) | 22.1MHz | |
Digi
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- | 2 IDC Headers 2x17 | Rabbit 3000 | 512KB | MPU Core | -40°C ~ 85°C | 512KB | 1.160" L x 1.380" W (29.50mm x 34.90mm) | 29.4MHz | |
Trenz Electronic
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- | - | Artix-7 A35T | - | FPGA Core | -40°C ~ 85°C | - | - | - | |
Digi
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- | IDC Header 2x25, 2x5 | Rabbit 4000 | 512KB | MPU Core | 0°C ~ 70°C | 512KB | 1.840" L x 2.420" W (47.00mm x 61.00mm) | 58.98MHz | |
Digi
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- | 2 IDC Headers 2x17 | Rabbit 3000 | 512KB | MPU Core | 0°C ~ 70°C | 512KB | 1.850" L x 2.730" W (47.00mm x 69.00mm) | 30MHz | |
Digi
|
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- | 2 IDC Headers 2x17, 1 IDC Header 2x5 | Rabbit 3000 | 512KB (Internal), 4MB (External) | MPU Core | -40°C ~ 70°C | 1MB | 1.850" L x 2.730" W (47.00mm x 69.00mm) | 44.2MHz | |
Parallax Inc.
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- | - | PIC16C57C | 2KB EEPROM | MCU Core | 0°C ~ 70°C | 32B | 1.200" L x 0.600" W (30.00mm x 15.00mm) | 20MHz | |
Lantronix, Inc.
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XPort AR | RJ45 | DSTni-EX | 512KB | MPU Core | -40°C ~ 85°C | 256KB | 0.570" L x 0.720" W (14.50mm x 18.30mm) | 25MHz | |
Lantronix, Inc.
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XPort® Pro Lx6 | RJ45 | IPv6 | 16MB | MPU Core | -40°C ~ 85°C | 16MB | 0.630" L x 1.330" W (16.00mm x 33.90mm) | - | |
Lantronix, Inc.
|
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XPort Direct+ | RJ45 | DSTni-EX | 512KB | MPU Core | -40°C ~ 85°C | 256KB | 1.250" L x 1.700" W (31.80mm x 43.30mm) | 25MHz | |
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Infineon Technologies
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Lantronix, Inc.
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XPort® Pro | RJ45 | IPv6 | 16MB | MPU Core | -40°C ~ 85°C | 16MB | 0.630" L x 1.330" W (16.00mm x 33.90mm) | - | |
Digi
|
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- | IDC Header 2x25, 2x5 | Rabbit 4000 | 512KB | MPU Core | 0°C ~ 70°C | 256KB | 1.410" L x 1.880" W (36.00mm x 48.00mm) | 29.49MHz | |
Lantronix, Inc.
|
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XPort Direct+ | RJ45 | DSTni-EX | 512KB | MPU Core | -40°C ~ 85°C | 256KB | 1.250" L x 1.700" W (31.80mm x 43.30mm) | 25MHz | |
NetBurner Inc.
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- | RJ-45, 2x50 Header | ColdFire 5270 | 512KB | MCU, Ethernet Core | -40°C ~ 85°C | 8.064MB | 2.600" L x 2.000" W (66.04mm x 50.80mm) | 147.5MHz | |
Zilog
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- | Header 2x30 | eZ80F91 | 256KB (Internal), 8MB (External) | MCU, Ethernet Core | 0°C ~ 70°C | 8KB (Internal), 512KB (External) | 2.500" L x 3.100" W (63.50mm x 78.70mm) | 50MHz | |
GHI Electronics, LLC
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- | - | ARM® Cortex®-M3 | 512KB (Internal), 4MB (External) | MCU Core | -40°C ~ 85°C (TA) | 96KB (Internal), 16MB (External) | 1.500" L x 1.050" W (38.10mm x 26.70mm) | 120MHz | |
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Digi
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NetBurner Inc.
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- | RJ-45, 2x50 Header | ColdFire 54415 | 32MB | MCU, Ethernet Core | -40°C ~ 85°C | 64MB | 2.950" L x 2.000" W (74.90mm x 50.80mm) | 250MHz | |
GHI Electronics, LLC
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- | - | ARM926EJ-S | 4MB (External) | MPU Core | -40°C ~ 85°C | 32KB (Internal), 128MB (External) | 2.670" L x 1.260" W (67.70mm x 31.90mm) | 400MHz | |
NetBurner Inc.
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- | RJ-45, 2x50 Header | ColdFire 5282 | 512KB | MCU, Ethernet Core | -40°C ~ 85°C | 8.064MB | 2.600" L x 2.000" W (66.04mm x 50.80mm) | 66MHz | |
Beacon EmbeddedWorks
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TMS320C6748 (DSP) | - | OMAP-L138 | 16MB | MPU, DSP Core | 0°C ~ 70°C | 64MB | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 375MHz | |
Beacon EmbeddedWorks
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TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 200 | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | -40°C ~ 85°C | 256MB | 0.590" L x 1.060" W (15.00mm x 27.00mm) | 800MHz | |
Beacon EmbeddedWorks
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TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 200 | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | 0°C ~ 70°C | 256MB | 0.590" L x 1.060" W (15.00mm x 27.00mm) | 1GHz | |
Advanced Micro Devices
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Arm® Cortex®-R5F | 2 x 240 Pin | ARM® Cortex®-A53 | 16GB eMMC, 64MB QSPI | FPGA Core | 0°C ~ 85°C (TJ) | 4GB | 3.030" L x 2.360" W (77.00mm x 60.00mm) | 533MHz, 1.333GHz | |
Advanced Micro Devices
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Arm® Cortex®-R5F | 2 x 240 Pin | ARM® Cortex®-A53 | 16GB eMMC, 64MB QSPI | FPGA Core | -40°C ~ 100°C (TJ) | 4GB | 3.030" L x 2.360" W (77.00mm x 60.00mm) | 533MHz, 1.333GHz |
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