What are Microcontrollers, Microprocessor, FPGA Modules ?
Microcontrollers, Microprocessor, FPGA Modules are integrated circuits designed to manage and control electronic devices. They are commonly used in embedded control systems, new product design, and production electronics assembly. Important specifications for selection include Core Processor, which determines processing power; Flash Size, which affects data storage capacity; and Operating Temperature, which ensures reliability under specific environmental conditions. Validating lifecycle status and exploring alternate-source options are crucial for procurement teams to mitigate sourcing risks.
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| Part & Mfr | Co | Connector Type | Core Processor | Flash Size | Module | Operating Temperature | RAM Size | Size | Speed | |||
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU4CG-1SFVC784E | 256MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Trenz Electronic
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- | - | - | - | - | - | - | - | - | |
Critical Link LLC
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NEON SIMD | Edge Connector | ARM® Cortex®-A9, Cyclone V SX/SE | 32MB | MPU, FPGA Core | -40°C ~ 85°C | 1.25GB | 3.200" L x 1.500" W (82.00mm x 39.00mm) | 800MHz | |
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Critical Link LLC
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TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | SO-DIMM-200 | ARM926EJ-S, OMAP-L138 | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | 0°C ~ 70°C | 128MB | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 456MHz | |
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System-On-Chip (SOC) Technologies
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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System-On-Chip (SOC) Technologies
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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System-On-Chip (SOC) Technologies
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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System-On-Chip (SOC) Technologies
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- | - | Artix-7 XC7A200T | 32MB | FPGA Core | - | 512MB | - | 200MHz | |
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Trenz Electronic
|
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Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Critical Link LLC
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TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | ARM926EJ-S, OMAP-L138 | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | -40°C ~ 85°C | 128MB | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 375MHz | |
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Trenz Electronic
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K160T-2FBG676I | 32MB | FPGA Core | -40°C ~ 85°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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Trenz Electronic
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | 32MB | FPGA Core | 0°C ~ 70°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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Trenz Electronic
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | 32MB | FPGA Core | 0°C ~ 70°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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System-On-Chip (SOC) Technologies
|
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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System-On-Chip (SOC) Technologies
|
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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System-On-Chip (SOC) Technologies
|
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- | - | Artix-7 XC7A200T | 32MB | FPGA Core | - | 512MB | - | 200MHz | |
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System-On-Chip (SOC) Technologies
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Xilinx Artix-7 XC7A200T | SO-DIMM | - | 32MB | DSP, FPGA Core | - | 512MB | - | - | |
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Critical Link LLC
|
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TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | SO-DIMM-200 | ARM926EJ-S, OMAP-L138 | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | -40°C ~ 85°C | 128MB | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 375MHz | |
Enclustra FPGA Solutions
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- | 168 Pin | Kintex-7 | 64MB | FPGA Core | -40°C ~ 85°C | 2GB | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | |
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Trenz Electronic
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | 32MB | FPGA Core | -40°C ~ 85°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Critical Link LLC
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NEON SIMD | Board-to-Board (BTB) | ARM® Cortex®-A9, Arria 10 SX | - | MPU, FPGA Core | 0°C ~ 70°C | 2GB | 4.000" L x 4.000" W (101.50mm x 101.50mm) | 1.2GHz | |
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
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Digi
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU5EV-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU4CG-1FBVB900I | 128MB | MPU Core | -40°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | - | 128MB | MPU Core | - | 4GB | - | - | |
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Trenz Electronic
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | 32MB | FPGA Core | 0°C ~ 70°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU5EV-1SFVC784I | 128MB | MPU Core | -40°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | 32MB | FPGA Core | -40°C ~ 85°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
Critical Link LLC
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NEON SIMD | Board-to-Board (BTB) | ARM® Cortex®-A9, Arria 10 SX | - | MPU, FPGA Core | -40°C ~ 85°C | 6GB | 4.000" L x 4.000" W (101.50mm x 101.50mm) | 1.2GHz | |
Digi
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- | RJ45 | ARM926EJ-S, NS9210 | 4MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
Trenz Electronic
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Zynq-7000 (Z-7020) | B2B | ARM Cortex-A9 | 32MB | MCU, FPGA | -40°C ~ 85°C | 512MB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Beacon EmbeddedWorks
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- | - | ARM926EJ-S, AM1808 | 16MB | MPU Core | -40°C ~ 85°C | 128MB | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 450MHz | |
Beacon EmbeddedWorks
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TMS320C6748 (DSP) | - | OMAP-L138 | 16MB | MPU, DSP Core | -20°C ~ 70°C | 128MB | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 375MHz | |
Beacon EmbeddedWorks
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- | Board-to-Board (BTB) Socket - 300 | ARM® Cortex®-A8, AM3517 | 512MB | MPU Core | -40°C ~ 85°C | 256MB | 1.610" L x 2.020" W (40.90mm x 51.20mm) | 600MHz | |
Beacon EmbeddedWorks
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- | - | DM3730 | 512MB (NAND), 16MB (NOR) | MPU Core | -40°C ~ 85°C | 256MB | 3.000" L x 1.220" W (76.20mm x 31.00mm) | 800MHz | |
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Beacon EmbeddedWorks
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TMS320C64x (DSP) | - | OMAP3530 | 512MB (NAND), 16MB (NOR) | MPU, DSP Core | -40°C ~ 85°C | 256MB | 3.010" L x 1.230" W (76.50mm x 31.20mm) | 600MHz | |
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Trenz Electronic
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- | Dual-pinout DIP-40 or 50mil 80 pin connector | Xilinx Spartan-7 XC7S25 | 64Mbit | FPGA Core | 0°C ~ 70°C | 64Mbit | 1.060" L x 2.050" W (27.00mm x 52.00mm) | 100MHz | |
Lantronix, Inc.
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XPort AR | RJ45 | DSTni-EX | 512KB | MPU Core | -40°C ~ 85°C | 256KB | 0.570" L x 0.720" W (14.50mm x 18.30mm) | 25MHz | |
Trenz Electronic
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- | 50 Pin | Artix-7 A15T | 32MB | FPGA Core | 0°C ~ 70°C | - | 2.870" L x 1.380" W (73.00mm x 35.00mm) | 100MHz | |
Trenz Electronic
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Zynq-7000 (Z-7000S) | 40 Pin | ARM Cortex-A9 | 16MB | MCU, FPGA | 0°C ~ 70°C | - | 0.710" L x 2.010" W (18.00mm x 51.00mm) | 33MHz | |
Trenz Electronic
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- | Samtec LSHM | Artix-7 A50T | 16MB | FPGA Core | -40°C ~ 85°C | 16MB | 1.180" L x 1.570" W (30.00mm x 40.00mm) | - | |
Trenz Electronic
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Zynq-7000 (Z-7007S) | CSI, DSI | ARM Cortex-A9 | 16MB | MCU, FPGA | 0°C ~ 70°C | 512MB | 1.180" L x 1.570" W (30.00mm x 40.00mm) | - | |
Trenz Electronic
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Zynq-7000 (Z-7010) | CSI, DSI | ARM Cortex-A9 | 16MB | MCU, FPGA | 0°C ~ 70°C | 512MB | 1.180" L x 1.570" W (30.00mm x 40.00mm) | - | |
Trenz Electronic
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- | 50 Pin | Artix-7 A100T | 32MB | FPGA Core | 0°C ~ 70°C | - | 2.870" L x 1.380" W (73.00mm x 35.00mm) | 100MHz | |
Trenz Electronic
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- | Samtec LSHM | Artix-7 A100T | 32MB | FPGA Core | 0°C ~ 70°C | 512MB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 100MHz | |
Trenz Electronic
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- | Samtec LSHM | Artix-7 A100T | 32MB | FPGA Core | -40°C ~ 85°C | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 100MHz |
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