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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc.
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Tin | - | Beryllium Copper | Open Frame | Liquid Crystal Polymer (LCP) | Surface Mount | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 9 (1 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (1 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8), 4 Loaded | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (1 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8), 8 Loaded | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14), 16 Loaded | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity AMP Connectors
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 30 (2 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole, Right Angle, Horizontal | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polysulfone (PSU), Glass Filled | Through Hole | 35 (1 x 17, 1 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | Zig-Zag, ZIF (ZIP) | ||
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
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Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Polyethersulfone (PES) | Through Hole | 100 (10 x 10) | -55°C ~ 150°C | 0.100" (2.54mm) | Solder | PGA, ZIF (ZIP) | ||
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Polyethersulfone (PES) | Through Hole | 361 (19 x 19) | -55°C ~ 150°C | 0.100" (2.54mm) | Solder | PGA, ZIF (ZIP) | ||
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Yamaichi Electronics Co Ltd
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Gold | - | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 144 | -40°C ~ 170°C | 0.020" (0.50mm) | Solder | QFP | |
CNC Tech
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Tin | 60.0µin (1.52µm) | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole, Kinked Pin | 8 (2 x 4) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
CNC Tech
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Open Frame | Polybutylene Terephthalate (PBT) | Through Hole | 14 (2 x 7) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
CNC Tech
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Open Frame | Polybutylene Terephthalate (PBT) | Through Hole | 16 (2 x 8) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Harwin Inc.
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Tin | Flash | Beryllium Copper | Open Frame | Plastic | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing |
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