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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 18 (1 x 18) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 20 (1 x 20) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 20 (2 x 10) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Samtec Inc.
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 14 (2 x 7) | - | 0.100" (2.54mm) | Solder | - | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 13 (1 x 13) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 27 (1 x 27) | - | 0.100" (2.54mm) | Solder | SIP | |
Mill-Max Manufacturing
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Tin | 100.0µin (2.54µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Surface Mount | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Surface Mount | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 25 (1 x 25) | - | 0.100" (2.54mm) | Solder | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 107 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 21 (1 x 21) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 15 (1 x 15) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 23 (1 x 23) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 25 (1 x 25) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 30 (1 x 30) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 30 (2 x 15) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole, Right Angle | 8 (1 x 8) | - | - | Solder | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 12 (1 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.4" (10.16mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 11 (1 x 11) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (1 x 16) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 6 (1 x 6) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 108 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole, Right Angle, Horizontal | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Surface Mount | 15 (1 x 15) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (1 x 12) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole, Right Angle, Horizontal | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 109 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Samtec Inc.
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 14 (2 x 7) | - | 0.100" (2.54mm) | Solder | - | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole, Right Angle, Horizontal | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 28 (1 x 28) | - | 0.100" (2.54mm) | Solder | SIP |