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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole, Bottom Entry; Through Board | 38 (2 x 19) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 30 (1 x 30) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 528 (21 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 529 (21 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 32 (1 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 32 (1 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 27 (1 x 27) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 223 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 59 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 59 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 69 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
|
Send RFQ |
Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.4" (10.16mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.4" (10.16mm) Row Spacing |