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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity
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Gold | - | - | Closed Frame | - | Through Hole | 18 (2 x 9) | - | 0.100" (2.54mm) | - | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | Polytetrafluoroethylene (PTFE) | Through Hole | 8 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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Gold | - | Copper Alloy | Closed Frame | - | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | - | Copper Alloy | Closed Frame | - | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Open Frame | Thermoplastic | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 15.0µin (0.38µm) | Phosphor Bronze | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | Fluoropolymer (FP) | Through Hole | 4 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | Polytetrafluoroethylene (PTFE) | Through Hole | 3 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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Gold | - | Beryllium Copper | - | Polytetrafluoroethylene (PTFE) | Panel Mount | 8 (Round) | -55°C ~ 125°C | - | Solder Cup | Transistor, TO-5 | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | - | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 6 (2 x 3) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 20 (2 x 10) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | - | Through Hole | 20 (1 x 20) | - | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | - | Through Hole | 6 (2 x 3) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | Thermoplastic, Glass Filled | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | Thermoplastic, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 10 (1 x 10) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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Tin | 150.0µin (3.81µm) | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS) | Surface Mount | 32 (2 x 7, 2 x 9) | - | 0.050" (1.27mm) | Solder | PLCC | |
TE Connectivity
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Tin | 180.0µin (4.57µm) | Copper Alloy | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 20 (4 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PLCC | |
TE Connectivity
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Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Thermoplastic | Through Hole | 20 (4 x 5) | - | 0.100" (2.54mm) | Solder | PLCC | |
Assmann WSW Components
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Gold | - | - | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Assmann WSW Components
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Gold | - | - | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Tin | - | Phosphor Bronze | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Phosphor Bronze | Closed Frame | Thermoplastic, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Open Frame | Thermoplastic, Glass Filled | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | - | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | - | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 24 (2 x 12) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 14 (2 x 7) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 22 (2 x 11) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
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Gold | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing |